Equipment

보유장비 리스트
이름 모델 장비이용의뢰서/예약하기

CMP | CMP (화학적표면 연마 시스템) / ORBIS

Seon Jin Lee 052-217-4193 sunee6210@unist.ac.kr
Equipment location : 108동 B101호

Dicing Saw | 기판 절단장치 / AR06DM

Eun Jeong Hwang 052-217-4192 hej9204@unist.ac.kr
Equipment location : 108동 B101호 (Bldg. 108, Room B101)

Dicing saw#2 | 기판절단장치 / NDS-1012

Seon Jin Lee 052-217-4193 sunee6210@unist.ac.kr
Equipment location : 자연과학관(108동) B101호

Lapping | Lapping / LP70

Seon Jin Lee 052-217-4193 sunee6210@unist.ac.kr
Equipment location : 108동 B101호 (Bldg. 108, Room B101)

Wire bonder | 와이어 본더 / HB02

Eun Jeong Hwang 052-217-4192 hej9204@unist.ac.kr
Equipment location : 108동 B104호(Bldg.108, Room B104)

Wire bonder#2 | 와이어본더#2 / FB 700

Eun Jeong Hwang 052-217-4192 hej9204@unist.ac.kr
Equipment location : 108동 B104호(Bldg.108, Room B104)