Dicing saw#2 | 기판절단장치
| Laboratory/Field | |||
|---|---|---|---|
| Model | NDS-1012 | ||
| Maker | (주)네온테크 | ||
| Technician | Hee-Song Hong | ||
| Contact | 052-217-4194 / [email protected] | ||
| Status for Reservation | 가능 | ||
| Reservation Unit | 2시간 | Maximum Time (per day) | 2시간 |
| Open(~ago) | 2주일 전 | Cancel (~ago) | 2시간 |
| Equipment location | 자연과학관(108동) B101호 | ||
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Description
Device to cut Silicon wafer into small chips using high-speed rotating diamond blade.
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Specifications
- Material Size: ø8”(Maximum ø200mm )
- X-axis cutting range: 270 mm
- Y-axis Indexing Range: 203 mm
- Y-axis positioning error: 0.002mm/200mm
- Spindle Speed Range: 3,000~50,000rpm
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Applications
• Wafer dicing for chip scale semiconductor
• Si/glass wafer dicing for fabrication process