Lapping | Lapping
| Laboratory/Field | |||
|---|---|---|---|
| Model | LP70 | ||
| Maker | Logitech | ||
| Technician | Kang O Kim | ||
| Contact | 052-217-4182 / [email protected] | ||
| Status for Reservation | 가능 | ||
| Reservation Unit | 1h | Maximum Time (per day) | 5h |
| Open(~ago) | 14day | Cancel (~ago) | 2h |
| Equipment location | 108동 B101호 (Bldg. 108, Room B101) | ||
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Description
웨이퍼 Thinning, Polishing 공정 장비
This equipment is for process of polishing and thinning of wafer
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Specifications
Loading : 6inch (wax bonding)
Plate speed : 5-100rpm (300mm diameter)
Jig rotation speed : 5-100rpm
Slurry, Abrasive flow rate : 1-100ml/min (2 Abrasive, 1 Slurry feeding)
Abrasive : Alumina
Slurry : Silica
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Applications