CMP | CMP (화학적표면 연마 시스템)
| Laboratory/Field | |||
|---|---|---|---|
| Model | ORBIS | ||
| Maker | Logitech | ||
| Technician | Kang O Kim | ||
| Contact | 052-217-4182 / [email protected] | ||
| Status for Reservation | 가능 | ||
| Reservation Unit | 1H | Maximum Time (per day) | 5H |
| Open(~ago) | 14D | Cancel (~ago) | 2H |
| Equipment location | 108동 B101호 | ||
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Description
CMP (Chemical mechanical polishing) 반도체 칩 제작에서 미세 표면 연마 혹은 평탄화를 하는 장비이다. 연마패드, 시료를 회전하면서 슬러리를 이용하여 표면을 연마 혹은 평탄화 한다.
CMP (Chemical mechanical polishing) is surface polishing and planarization process in the semiconductor. It conduct polishing by rotation of pad and sample with slurry.
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Specifications
Loading template : 20X20mm, 4, 6, 8 inch
Plate speed : Max. 160rpm (600mm diameter)
Carrier speed : 10-125rpm
Carrier back pressure : Max. 50PSI
Carrier down pressure : 0.4-9PSI
Slurry flow rate : 20-500ml/min
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Applications