이름 | 모델 | 장비이용의뢰서/예약하기 |
---|---|---|
CMP | CMP (화학적표면 연마 시스템) / ORBISEquipment location : 108동 B101호 |
Request of Analysis Reservation | |
Dicing Saw | 기판 절단장치 / AR06DMEquipment location : 108동 B101호 (Bldg. 108, Room B101) |
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Dicing saw#2 | 기판절단장치 / NDS-1012Equipment location : 자연과학관(108동) B101호 |
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Lapping | Lapping / LP70Equipment location : 108동 B101호 (Bldg. 108, Room B101) |
Request of Analysis Reservation | |
Wire bonder | 와이어 본더 / HB02Equipment location : 108동 B104호(Bldg.108, Room B104) |
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Wire bonder#2 | 와이어본더#2 / FB 700Equipment location : 108동 B104호(Bldg.108, Room B104) |
Request of Analysis Reservation |