Equipment

Substrate Bonder | 기판 접합 장치

보유장비 관련 정보
Laboratory/Field
Model SB6L
Maker Suss Microtec
Technician Min-jae Kim
Contact 052-217-4064 / mjkim@unist.ac.kr
Status for Reservation 가능
Reservation Unit 5hr Maximum Time (per day) 5hr
Open(~ago) 2주전 Cancel (~ago) 2hr
  • Description

    Anodic bonder performs fine alignment and permanent bonding between 2 wafers by heat, voltage and pressure in a vacuum chamber.

  • Specifications

    • Wafer size : 6" semi standard wafer

    • Pressure regulation accuracy : ± 2 %

    • Maximum temperature : 500 °C

    • Temperature uniformity : ± 3 %

    • Maximum bond force : 8 kN

    • Bond voltage and current (Anodic optional)

    • Maximum voltage : 2,000 V ± polarity

    • Maximum current : 60 mA

  • Applications

    • Anodic bonding for wafer to glass

    • Thermo-compression bonding

    • Eutectic bonding using metal layer