Equipment

RTP | Rapid Thermal Processing (급속 열처리 시스템)

보유장비 관련 정보
Laboratory/Field
Model AW610
Maker Allwin21
Technician Kang O Kim
Contact 052-217-4182 / [email protected]
Status for Reservation 가능
Reservation Unit 30min Maximum Time (per day) 4hour
Open(~ago) 14day Cancel (~ago) 2hour
Equipment location 108 building B101 (Nanofabrication center)
  • Description

    수 초~수 분 내에 열처리를 필요로 하는 공정에 사용되는 장비임

    This equipment used for heating process in few seconds to minutes.

  • Specifications

    • Wafer Size : 4~6” wafer & pieces

    • Tray : Metal, Non-Metal

    • Duration time : 0~300 s/step

    • Temperature : Max. 1000 ℃

    • Ramp up rate : 10~120 ℃/s

    • Temp Control : Thermocouple or Pyrometer

    • Gas : N2, O2 (Max. 10 SLM)

  • Applications

    Annealing