RTP | Rapid Thermal Processing (급속 열처리 시스템)
| Laboratory/Field | |||
|---|---|---|---|
| Model | AW610 | ||
| Maker | Allwin21 | ||
| Technician | Hae-ra Kang | ||
| Contact | 052-217-4167 / haera@unist.ac.kr | ||
| Status for Reservation | 가능 | ||
| Reservation Unit | 30min | Maximum Time (per day) | 4hour |
| Open(~ago) | 14day | Cancel (~ago) | 2hour |
| Equipment location | 108 building B101 (Nanofabrication center) | ||
-
Description
수 초~수 분 내에 열처리를 필요로 하는 공정에 사용되는 장비임
This equipment used for heating process in few seconds to minutes.
-
Specifications
• Wafer Size : 4~6” wafer & pieces
• Tray : Metal, Non-Metal
• Duration time : 0~300 s/step
• Temperature : Max. 1000 ℃
• Ramp up rate : 10~120 ℃/s
• Temp Control : Thermocouple or Pyrometer
• Gas : N2, O2 (Max. 10 SLM)
-
Applications
Annealing