Equipment

Metal ICP-RIE | 유도결합 플라즈마 금속 건식 식각기

보유장비 관련 정보
Laboratory/Field
Model FABStar
Maker TTL
Technician Kang O Kim
Contact 052-217-4182 / ko8809@unist.ac.kr
Status for Reservation 가능
Reservation Unit 1Hr Maximum Time (per day) 3Hr
Open(~ago) 14Days Cancel (~ago) 1Hr전
  • Description

    유도결합 플라즈마와 가스를 이용하여 Al, Ti, Cr, Au, Al2O3와 같은 재료를 식각하기 위해서 설계된 장치이다.

    This eqipment is designed for etching metals like Al, Ti, Cr, Au and Al2O3, ITO.

  • Specifications

    -Process gas : CF4, SF6, Cl2, BCl3, HBr, Ar, O2, N2

    -Sample : Standard 150 mm (6 inch)

    • Al etch

    -Etch rate > 2000 Å/min

    -Selectivity (PR) > 2:1

    -Uniformity > 95% (150mm)

    -Profile angle > 90 ± 5 degree

    • Cr

    -Etch rate <300 Å/min

    -Selectivity (PR) <0.5:1

    -Uniformity >95% (150mm)

    -Profile angle > 90 ± 5 degree

  • Applications

    Al, Ti, Cr, Au, Al2O3, ITO