Deep Si Etcher | 깊은준위 건식식각 장치

보유장비 관련 정보
Model Tegal 200
Maker Tegal France
Technician Kang O Kim
Contact 052-217-4182 /
Status for Reservation 가능
Reservation Unit 1hr Maximum Time (per day) 3hr
Open(~ago) 2주전 Cancel (~ago) 2hr
Equipment location 108동 B101호 (Bldg. 108, Room B101)
  • Description

    Micro electro mechanical systems (MEMS) fabrication, deep reactive ion etching (DRIE) is one of the most characteristic widely utilized techniques.

  • Specifications

    • Source generator : 5000 W

    • Chuck generator : 300 W

    • E-chuck hellium cooling system

    • SF6 / C4F8 / O2 bosch process

    • Deep silicon etching

    • Loadlock / Process chamber transfer

  • Applications

    • Deep etching process of Si