Equipment

Deep Si Etcher | 깊은준위 건식식각 장치

보유장비 관련 정보
Laboratory/Field
Model Tegal 200
Maker Tegal France
Technician Kang O Kim
Contact 052-217-4182 / ko8809@unist.ac.kr
Status for Reservation 가능
Reservation Unit 2hr Maximum Time (per day) 2hr
Open(~ago) 2주전 Cancel (~ago) 2hr
  • Description

    Micro electro mechanical systems (MEMS) fabrication, deep reactive ion etching (DRIE) is one of the most characteristic widely utilized techniques.

  • Specifications

    • Source generator : 5500 W

    • Chuck generator : 300 W

    • E-chuck hellium cooling system

    • SF6 / C4F8 / O2 bosch process

    • Deep silicon etching

    • Loadlock / process chamber transfer

  • Applications

    • Deep etching process of Si / SiO2 / Si3N4

    • 100um 이상 식각 외부 의뢰는 받지 않습니다.