Equipment

DC Sputter | 메탈 스퍼터링 시스템

보유장비 관련 정보
Laboratory/Field
Model SRN-120
Maker SORONA
Technician Hyung Il Kim
Contact 052-217-4065 / hikim78@unist.ac.kr
Status for Reservation 가능
Reservation Unit 1hr Maximum Time (per day) 2hr
Open(~ago) 2주전 Cancel (~ago) 2hr
  • Description

    DC Sputtering system is a multi-purpose tool generating plasma inside chamber by supplying 3 kw DC power to cathode and capable of thin film deposition of metal materials on wafer by sputtering a metal target by DC negative voltage.

  • Specifications

    • Substrate size : 4, 6 inch wafer

    • Substrate rotation speed : 0 ~ 60 rpm

    • Substrate pre-cleaning : RF 300 W, automatic processing

    • Substrate heating : 400 °C ± 3 % (wafer temp)

    • Target materials : Ti, Cr, Al, Ag , Ta, Ni, Co, Mg, Mo, W..

    • Power source : 3 kW DC power processing

    • Uniformity : less than ± 5 % within wafer

  • Applications

    • Thin film for semiconductor

    • Fabrication of contacts interconnects