DC Sputter | 메탈 스퍼터링 시스템
| Laboratory/Field | |||
|---|---|---|---|
| Model | SRN-120 | ||
| Maker | SORONA | ||
| Technician | Hyung Il Kim | ||
| Contact | 052-217-4065 / hikim78@unist.ac.kr | ||
| Status for Reservation | 가능 | ||
| Reservation Unit | 1hr | Maximum Time (per day) | 2hr |
| Open(~ago) | 2주전 | Cancel (~ago) | 2hr |
| Equipment location | 108동 B101호(Bldg, 108, Room B101) | ||
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Description
DC Sputtering system is a multi-purpose tool generating plasma inside chamber by supplying 3 kw DC power to cathode and capable of thin film deposition of metal materials on wafer by sputtering a metal target by DC negative voltage.
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Specifications
• Substrate size : 4, 6 inch wafer
• Substrate rotation speed : 0 ~ 60 rpm
• Substrate pre-cleaning : RF 300 W, automatic processing
• Substrate heating : 400 °C ± 3 % (wafer temp)
• Target materials : Ti, Cr, Al, Ag , Ta, Ni, Co, Mg, Mo, W..
• Power source : 3 kW DC power processing
• Uniformity : less than ± 5 % within wafer
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Applications
• Thin film for semiconductor
• Fabrication of contacts interconnects