CCP etcher | CCP etcher (용량성 결합 플라즈마 식각장치)
| Laboratory/Field | |||
|---|---|---|---|
| Model | Telius | ||
| Maker | TEL | ||
| Technician | Kang O Kim | ||
| Contact | 052-217-4182 / [email protected] | ||
| Status for Reservation | 가능 | ||
| Reservation Unit | 1H | Maximum Time (per day) | 8H |
| Open(~ago) | 14Day | Cancel (~ago) | 2Hr |
| Equipment location | 108동 B101호 나노소자공정실 | ||
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Description
12인치 공정이 가능한 플라즈마 식각장치
SiO2, Si3N4 공정Plasma etching for 12inch wafer
SiO2, Si3N4 etching process -
Specifications
Wafer : 12 inch
RF : Top/Bottm (5kW/5kW)
Gas : Cl2, HBr, CF4, CHF3, SF6, CH2F2, Ar, O2, H2, NF3
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Applications
Dry etching (SiO2, Si3N4)