Cluster ALD | 원자층 증착 장비
연구실/분야 | |||
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모델명 | Atomic premium | ||
제조사 | CN1 | ||
담당자 | 강해라 | ||
연락처 | 052-217-4167 / haera@unist.ac.kr | ||
예약 가능여부 | 가능 | ||
예약단위 | 3hr | 1일최대예약시간 | 5hr |
예약Open(~일 전) | 2주전 | 예약취소불가(~일 전) | 2hr |
장비위치 | 108동 B101호 (Bldg. 108, Room B101) |
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Description
ALD is a thin film deposition technique that is based on the sequential use of a gas phase chemical process. The majority of ALD reactions use two chemicals, typically called precursors. These precursors react with the surface of a material one at a time in a sequential, self-limiting, manner. Through the repeated exposure to separate precursors, a thin film is slowly deposited.
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Specifications
• Substrate size : 4 ~ 8 inch silicon wafer
• Process temperature : 30 °C ~ 450 °C
• Deposition uniformity : less than ± 2 % within wafer
• Dual process mode : termal and plasma
• Shower head type multi-chamber cluster tool
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Applications
• Dielectric thin films : Al2O3, HfO2, etc
• Nitride & metal thin films : TaN, etc