Substrate Bonder | 기판 접합 장치
| 연구실/분야 | |||
|---|---|---|---|
| 모델명 | SB6L | ||
| 제조사 | Suss Microtec | ||
| 담당자 | 김민재 | ||
| 연락처 | 052-217-4064 / [email protected] | ||
| 예약 가능여부 | 가능 | ||
| 예약단위 | 5hr | 1일최대예약시간 | 5hr |
| 예약Open(~일 전) | 2주전 | 예약취소불가(~일 전) | 2hr |
| 장비위치 | 108동 B101호 (Bldg.108, Room B101) | ||
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Description
Anodic bonder performs fine alignment and permanent bonding between 2 wafers by heat, voltage and pressure in a vacuum chamber.
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Specifications
• Wafer size : 6" semi standard wafer
• Pressure regulation accuracy : ± 2 %
• Maximum temperature : 500 °C
• Temperature uniformity : ± 3 %
• Maximum bond force : 8 kN
• Bond voltage and current (Anodic optional)
• Maximum voltage : 2,000 V ± polarity
• Maximum current : 60 mA
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Applications
• Anodic bonding for wafer to glass
• Thermo-compression bonding
• Eutectic bonding using metal layer