(UNIST)Self -user : 50 % Client : 100 % Enterprise out of Ulsan : 120% (Unit : won)
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공용장비이용료 Division Equipment (Model) Analysis Item Unit Fee Remarks UNIST (70%) Client (100%) UMCL Electron Microscopy Advanced TEM (Titan G2 Cube 60-300) TEM hr 292,320 417,6000 CS-STEM(JEM-ARM300F) TEM, STEM, EDS, EELS hr 219,240 313,200 HR-TEM (JEM-2100F With Cs Corrector) Imaging, STEM, EDS hr 146,160 208,800 -Grid : 10,000won Normal TEM (JEM-2100) Imaging, STEM, EDS hr 73,080 104,400 Bio-TEM (JEM-1400) Imaging hr 58,460 83,520 Quanta 3D FIB (Quanta 3D FEG) Milling hr 146,160 208,800 -Mo grid : 40,000won -Gel pack : 20,000won TEM 시편제작 hr 146,160 208,800 Imaging, EBSD hr 43,840 62,640 Helios 450HP FIB (Helios 450 HP) Milling, Image hr 146,160 208,800 TEM 시편제작 sample 292,320 417,600 NX2000 FIB (NX2000) Milling, Image hr 146,160 208,800 TEM 시편제작 sample 292,320 417,600 SU7000 FE-SEM (SU7000 SEM) Imaging, EDS hr 56,370 81,420 SU8220 Cold FE-SEM (SU8220 Cold SEM) Imaging, EDS hr 56,370 81,420 Cold FE-SEM (S4800 Cold SEM) Imaging, EDS hr 43,840 62,640 Nano230 FE-SEM (Nova Nano230 SEM) Imaging, EDS hr 36,540 52,200 Quanta200 FE-SEM (Quanta200 SEM) Imaging, EDS hr 36,540 52,200 Electron Microscopy Sample Preparation Advanced Plasma System Cleaning sample 7,300 10,440 Dimple Grinder Dimpling hr 3,650 5,220 FEI Sputter Sputtering sample 7,300 10,440 Hitachi Sputter Sputtering sample 7,300 10,440 Inverted Metallurgical Microscope Imaging hr 7,300 10,440 Ion Milling System Milling hr 18,270 26,100 Low Angle Ion Mill Milling hr 14,610 20,880 Low Speed Saw (Techcut4) Sawing hr 5,110 7,300 Mechanical Polishing System (Metprep3) Polishing hr 7,300 10,440 -Silicon carbide: 5,000/ea Mechanical Polishing System (Multiprep) Polishing hr 7,300 10,440 Mounting Press Mounting sample 14,610 20,880 Nano Mill Milling hr 18,270 26,100 Plunge Freezer Sample preparation for TEM hr 36,540 52,200 PIPS Milling hr 14,6100 20,880 Ultramicrotome (Leica EU7, RMC CR-X) SEM용 시편제작(상온) sample 51,150 73,080 TEM용 시편제작(상온) sample 73,080 104,400 SEM용 시편제작(저온) sample 95,000 135,720 TEM용 시편제작(저온) sample 146,160 208,800 Precision Etching Coating System Coating (C) frequency of use 21,920 31,320 Coating (Ti, Ta, Cr) frequency of use 29,230 41,760 X-ray Analysis High Power XRD (D/MAX2500V/PC) WAXS hr 36,540 52,200 VT-XRD, In-situ hr 36,540 – High Resolution XRD (D8 Advance) Phase Analysis hr 36,540 52,200 High Resolution Power XRD Cu Kalpha1 Phase Analysis hr 73,080 104,400 Capillary price is the same Cu Kalpha (Kalpha1+Kalpha2) Phase Analysis hr 36,540 52,200 Multi-purpose High Power XRD (Smart Lab XE) Phase Analysis hr 36,540 52,200 In-situ hr 36,540 52,200 In-situ (He gas) hr 5,220 5,220 extra charge XRF (D8 Tiger) Element Analysis sample 36,540 52,200 Spectroscopic Analysis Varian 600MHz NMR (Solid-state NMR) 1H (or within 20 min) sample 24,110 34,440 Overnight experiment (50% discount) 13C CP-MAS 1.5 hr 108,480 154,980 13C DP-MAS 3 hr 216,960 309,960 Solid (other) hr 72,340 103,350 Overnight (50%) 16 hr 578,640 826,560 Preprocessing(Rotor) sample 80,000 80,000 Bruker Cryogenic 600MHz NMR (Solution NMR) 1H (or within 20 min) sample 16,070 22,960 Cryogenic 600 NMR : 2-3 times higher sensitivity compared to the existing 600 NMRex) 400/1hr = 600/18min = Cryo 600/5min· Sample tube (400 MHz) 1) WG-1000: 6,000 2) WG-1228: 11,000 3) WG-535-PP: 50,000· Sample tube (600 MHz) 1) WG-1000: 6,000 2) WG-1241: 20,000 3) WG-535-PP: 50,000· NMR solvent 1) D2O, CDCl3: 6,000 2) DMSO-D6: 20,000 3) D2O4, TFA-D: 20,000 4) THF-D8, DMF-D7: 40,000 5) Others: Actual expense settlement· Special experiment: Temperature experiment, 2D NMR, etc. 13C hr 48,210 68,880 Special experiment hr 48,210 68,880 Preprocessing sample Remarks Remarks Bruker 400 NMR (Solution NMR) 1H (or within 20 min) sample 8,760 12,520 13C hr 26,300 37,580 Special experiment hr 39,420 56,340 Preprocessing sample Remarks Remarks FT-IR (670-IR/620-IR) Main body (ATR mode) hr/sample 21,920 (hr) 10,440 (sample) Main body (acc. mode) hr/sample 32,880 (hr) 15,660 (sample) Microscope hr/sample 43,840 (hr) 20,880 (sample) UV-Vis-NIR (Cary 5000) basic(%T, Abs) hr 18,270 13,050 (based on 30 min. per sample) Reflectance measurement Using ACC(%R) hr/sample 21,920 26,100 (sample) UV-Vis-NIR Microspectrometer (20/20 PV) Qualitative analysis hr 19,000 27,140 Fluorometer (Cary Eclipse) Fluorescence analysis hr/sample 7,300 10,440 Spectrofluorometer (FP-8500ST) Quantum yield hr 18,270 26,100 Zeta Potential (Nano ZS) Potential measurement hr 19,000 27,140 Preprocessing Claim actual fee Claim actual fee Electron Spin Resonance Spectrometer (EMX plus) ambient temperature hr/sample 36,540 52,200 Low temperature(L-N2) hr/sample 51,150 73,080 Ultra-low temperature(L-He) hr/sample 51,150 73,080 Preprocessing sample Claim actual fee Claim actual fee Surface Analysis XPS (K-alpha) Qualitative sample 43,840 62,640 Basically, a measurement that does not exceed 1 hour is considered one sample. When exceeding 1 hour, an external fee of 60,000 won/hour is added. Depth sample 87,690 125,280 UPS (Escalab230) Surface analysis hr/sample 65,770 93,960 Basically, a measurement that does not exceed 1 hour is considered one sample. When exceeding 1 hour, an external fee of 90,000 won/hour is added. Depth profile hr/sample 109,620 156,600 AFM (MultimodeV) Surface analysis & multi mode hr 36,540 52,200 -Probe actual fee applied AFM (Dimension, Ikon) Surface analysis & multi mode hr 36,540 52,200 -Probe actual fee applied AFM-Raman Confocal Raman (Alpha300S/Alpha300R) Element Analysis hr 18,270 26,100 TOF-SIMS (TOF SIMS 5) Basic fee basic fee 73,080 104,400 – Additional costs apply if exceeding 1hour -additional cost incurred for data reprocessing Surface Analysis sample 51,150 73,080 Depth Profile sample 51,150 73,080 Imaging sample 51,150 73,080 Physisorption Analyzer (ASAP 2420, 2020) surface area sample 43,840 62,640 surface area & others (meso pore) sample 58,460 83,520 surface area & others (micro pore) sample 73,080 104,400 Mass Analysis MALDI-TOF/TOF (autoflex Max) MS sample 21,920 31,320 – Autonomous usage is billed per hour (30 minutes) MS/MS sample 43,840 62,640 GC/MS/MS (450-GC & 320-MS) DIP MS sample 21,920 31,320 GC/MS sample 43,840 62,640 GC/MS/MS sample 65,770 93,960 HPLC/MS/MS (HCT Basic System) ESI MS sample 21,920 31,320 MS/MS sample 43,840 62,640 LC/MS sample 51,150 73,080 LC/VWD sample 51,150 73,080 LC/VWD/MS sample 62,110 88,740 LC/MS/MS sample 73,080 104,400 GPC/MALS (Agilent 1200S miniDAWN TREOS) GPC sample 21,920 31,320 MALS sample 62,110 88,740 DART-HRMS (AccuTOF 4G+ DART) ESI, DART sample 21,920 31,320 Use of HR mode sample 7,300 10,440 UPLC/Q-TOF-MS (Xevo G2 Q-TOF) HRMS sample 21,920 31,320 MS/MS sample 43,840 62,640 LC/MS sample 73,080 104,400 LC/MS/MS sample 87,690 125,280 UPLC sample 36,540 52,200 Element Analyzer (Flash 2000) C,H,N,S analysis (basic 3 times) sample 29,230 41,760 O analysis sample 29,230 41,760 LC/MS/MS (Orbitrap Elite, Q Exactive plus) Protein Identify Sample 219,240 313,200 Protein Identify (Shot-gun) Sample 657,720 939,600 Phophopeptide Site Determination Sample 125,280 187,920 In-Gel Digestion Sample 36,420 52,200 1D SDS-PAGE Mini Gel / Silver Staining Gel 73,080 104,400 1D SDS-PAGE Mini Gel / Colloidal Staining Gel 58,460 83,520 1D SDS-PAGE Gradient Gel / Silver Staining Gel 146,160 208,800 1D SDS-PAGE Gradient Gel / Colloidal Staining Gel 125,280 187,920 ESI MS Sample 29,230 41,760 Thermal & Physical Analysis Thermal Analysis (TA Q200, Q600, Q800, Q500) Thermal analysis (Basic 2hour) sample 21,920 31,320 extra time hr 3,650 5,220 Low temperature use (Q800) sample 7,300 10,440 Diatometry Thermal analysis hr 36,540 52,200 -Basic 3-hour measurement -Additional fee of 10,000 won per hour Seebeck Coefficient Analyzer (SBA458) Seebeck coefficient, electrical conductivity sample 14,610 20,880 -Basic 3-hour measurement -Additional fee of 5,000 won per hour Rheometer (Haake Mars 3) Measurement of physical properties 기본료 (2hr) 29,230 41,760 hr hr 3,650 5,220 -
공용장비이용료 Division Equipment (Model) Analysis Item Unit Fee Remarks UNIST (70%) Client (100%) UNFC E-beam lithography (NB3) Process 2 hr 219,240 313,200 – Pattern provided by requester -Basic ER/PR and chemical supplied (AR-P 6200.09, AR-P 671.04, AR-N 7520.18, AR 600-546, AR 300-71, AR 300-46) – Data consulting, Job file making, e-beam resist coating, baking & develop fee additional fee 0.5 hr 58,460 83,520 E-beam lithography #2 (Attach) Process 0.5 hr 36,540 52,200 Photo lithography (MA6#1,#2) Process 0.5 hr 21,920 31,320 -Basic PR and chemical supplied (GXR601, DPRi-1549, AZ5214, AZ4330, nLOF2035, MIF300) -Spin coater, Wet Station, Oven, Hot plate free -using personal materials (PR): 1,800won/30min discount Photo lithography (MDA400S) Process 0.5hr 18,270 26,100 Laser lithography (Picomaster 200) Process 0.5hr 36,540 52,200 Deep Si Etcher (Tegal 200) Process 1 time ≤ 100 um 109,620 156,600 -Over 100μm, separate negotiation required additional fee 100 um 36,540 52,200 Dielectric RIE (Labstar) Process 1 time 43,840 62,640 Separate consultation if proceeding for more than 30 minutes Metal RIE (Labstar) Process 1 time 43,840 62,640 Dielectric ICP-RIE (FABstar) Process 1 time 65,770 93,960 Metal ICP-RIE (FABstar) Process 1 time 65,770 93,960 CCP etcher Process 1 time ≤ 30 min 182,700 261,000 Plasma PR Stipper (PTP 300) Process 1 time 29,230 41,760 Plasma Treatment System (V15-G) Process 0.5 hr 29,230 41,760 XeF2 etcher Process 1 time 73,080 104,400 -Material cost gas separate (500won per 1cycle) Wet Station (Wet Station) Process 0.5 hr 10,960 15,660 -Free for long-term admission fee payers E-beam Evaporator #1 (Temescal_FC-2000)) Process 1 time ≤ 300nm 65,770 93,960 -Based on one sheet of 6 inches -applied actual cost of materials(Au, Ag, Pd, Pt etc.) -Special metal and crucible to be provided by the user -An additional process fee will be charged for every 300 nm additional fee Add layer 32,880 46,980 100 C 21,920 31,320 E-beam Evaporator #2 (WC-4000) Process 1 time ≤ 300nm 65,770 93,960 additional fee Add layer 32,880 46,980 100 C 21,920 31,320 DC Sputter (SRN-120) Process 1 time ≤ 500 nm 43,840 62,640 -Special target consultation (user prepared) -additional fee – temperature: 100℃/30,000won – Add layer 30,000won additional fee ≤ 100 nm 7,300 10,440 RF Sputter (SRN-120) Process 1 time ≤ 30 min 65,770 93,960 additional fee ≤ 30 min 65,770 93,960 DC HSC Sputter (SRN130) Process 1 time ≤ 500 nm 43,840 62,640 additional fee ≤ 100 nm 7,300 10,440 RF HSC Sputter (SRN130) Process 1 time ≤ 30 min 65,770 93,960 additional fee ≤ 30 min 65,770 93,960 PE CVD #1, #2 (PEH-600) Process per 65,770 93,960 additional fee ≤ SiO2 1um ≤ Si3N4 0.5 um PE CVD#3 (FABStar-PECVD) Process per 65,770 93,960 additional fee ≤ SiC 0.5 um ≤ Si3N4 0.5 um Atomic layer deposition (Lucida D100) Process per 109,620 156,600 -additional fee -If additional deposition of 100Å or more -40,000 won per 50Å Atomic layer deposition (Atomic premium CN1) Process per 109,620 156,600 LP CVD_Poly/Nitride (KVL206) Process One batch (25 pieces) 219,240 313,200 addtional fee ≤ D-Ploy 0.3 um ≤ Si3N4 0.5 um LP CVD_TEOS (VULCAN-V61RL) Process One batch (25 pieces) 219,240 313,200 addtional fee ≤ SiO2 0.3 um Auto Parylene Coating system (NRPC-500) Process 1time 73,080 104,400 Furnace (KHD-306) Process One batch (25 pieces) 219,240 313,200 – Wet oxidation film: based on 1μm – Dry oxidation film: based on 0.3μm Rapid Thermal Processing RTP, RTO 30 min 36,540 52,200 CMP&Lapping system CMP Basic fee(Wf) 73,080 104,400 4/6/8’‘ wafer, Piece: 20x20mm > 1 um 73,080 104,400 Lapping & polishing Basic fee(Wf) 43,840 62,640 Max. 6’‘ wafer > 200 um 14,610 20,880 Dicing Saw#2 (NDS-1012) post-process per (Process A) 21,920 31,320 -Process A: Non-pattern -Process B: Pattern -additional fee: More than 30 dicing lines Glass, Quartz, Si and other substrate consultation per (Process B) 29,230 41,760 Additional fee (>30 line) 7,300 10,440 Wire bonder #1, #2 post-process 1 hr 21,920 31,320 Normal SEM Microstructure profile analysis hr 29,230 41,760 Additional fee: Sputter use Additional fee 5,220 10,440 AFM (NX20) measurement 30 min 18,270 26,100 -probe actual fee applied Ellipsometer (AR06DM) measurement per session 10min 4,380 6,260 -Additional fee: new material, reference data -Free for long-term admission fee payers Additional fee 5,220 10,440 Thickness Measurement (ST4000-DLX) Free for long-term admission fee payers per session 10min 4,380 6,260 Free for long-term admission fee payers Surface Profiler (P-6) measurement 10 min per session 4,380 6,260 Surface & Height 3D profiler measurement 10 min per session 4,380 6,260 Measurement Microscope (Axio Scope A1) measurement per session ≤ 30min 7,300 10,440 4-Point Probe System (CMT-SR2000N) measurement 10 min per session 4,380 6,260 Probe station measurement 1 hr 29,230 41,760 Low temp. (8 hr) 133,630 167,040 admission fee fee by period 7,300/day 112,750/1M 224,460/3M 396,720/6M -
공용장비이용료 Division Equipment (Model) Analysis Item Unit Fee Remarks UNIST (70%) Client (100%) UEAC GC/HRMS (JMS-800D, JMS-800D UF, JMS-700d) HRMS Sample 219,240 313,200 Quantitation analysis: The number of samples is calculated by adding standard samples. GC/MS (Agilent 7890A/5975C) GC/MS Sample 43,840 62,640 Quantitation analysis: The number of samples is calculated by adding standard samples. GC/MS/MS (Agilent 7010B QQQ) GC/MS/MS Sample 65,770 93,960 Quantitation analysis: The number of samples is calculated by adding standard samples. ICP/MS (Nexion 2000 & Nexion 5000) Element Analysis Sample (1element) 36,540 52,200 • 1 element basis • 5,220 won/additional elements Pre-treatment Sample 21,920 31,320 GC/ECD (7890A/u-ECD) GC Sample 36,540 52,200 LC/MS/MS (Xevo TQ-S) Quantitative analysis Sample 73,080 104,400 Quantitation analysis: The number of samples is calculated by adding standard samples. ICP-OES (720-ES & iCAP Pro) Element Analysis Sample 18,270 26,100 • 3 element basis • 3,130 won/additional elements Pre-treatment(Acid) Sample 21,920 31,320 Pre-treatment(Fusion) Sample 43,840 62,640 GCxGC/tof-MS (Pegasus 4D) GC Sample 43,840 62,640 2D GC Sample 73,080 104,400 -
공용장비이용료 Division Equipment (Model) Analysis Item Unit Fee Remarks UNIST (70%) Client (100%) UDMC CNC 5-Axis Machining (C40U) Precision processing hr 51,150 73,080 -Material fee & Design fee separate CNC 3-Axis Machining (B300V) Precision processing hr 36,540 52,200 CNC late (TPL-6) Presision cylindrical processing hr 21,920 31,320 Lathe (TIPL-410) Cylindrical processing hr 10,960 15,660 Vertical Milling Machine (STM-2VM) plane processing hr 10,960 15,660 CNC Surface Grinding (DSG-630) precision plane processing hr 21,920 31,320 -Material fee & Design fee separate Metal Cutting Band Saw (KDBS-200) Material cutting per 3,650 5,220 -Material fee & Design fee separate Electro Discharge Machine (znc200m) Shape electric discharge machining hr 21,920 31,320 -Material fee & Design fee separate Coordinate Measuring Machine (pgs) Precision measurement hr 18,270 26,100 -Design fee separate Three-Dimensional Measurement (NV-3000) 3D measurement hr 18,270 26,100 -Design fee separate Semi Auto Formtracer System (SC-V3100) Precision measurement 0.5 hr 14,610 20,880 -Design fee separate Mult-Component Dynamometer (2825A) Precision measurement hr 14,610 20,880 -Design fee separate Laser Interferometer (XL-80) Precision measurement hr 14,610 20,880 -Design fee separate Powerful Microscope (MF-1010B) Precision measurement 0.5 hr 14,610 20,880 -Design fee separate Mini lathe & Milling (ML-360) Processing of small structures per 3,650 5,220 – Material fee & Design fee separate Bench Drilling Machine (MD-360) hole processing per 3,650 5,220 – Material fee & Design fee separate Plotter (HP Z6200) paper per 36,540 – Fabric per 41,760 – Universal Testing Machine (AGS-100NX) Precision measurement hr 14,610 20,880 -Design fee separate Electron-Beam PIKA Machine(PF32B) Precision processing hr 36,540 52,200 -Material fee & Design fee separate Ultra- Precision Nano Machine (FANUC ROBONANO α – 0iB) Precision processing 2hr 87,690 125,280 -Material fee & Design fee separate 3D Print (sPro TM 60SD SLS Center) Prototype production per 36,540 52,200 -Material fee separate Laser Cutting Machine (K2CMS1) Precision cutting 0.5 hr 21,920 31,320 -Material fee & Design fee separate 3D Scanner (REXCAN DS2) Precision measurement 0.5 hr 14,610 20,880 -Design fee separate Wire-Cut EDM (SL400G) Precision cutting hr 29,230 41,760 -Material fee & Design fee separate Welding (350A) product joining 0.5 hr 10,960 15,660 -Material fee & Design fee separate CNC Multi Tasking Machine (NTX 1000) Turning/milling processing hr 43,840 62,640 -Material fee & Design fee separate ULTRASONIC Machine (20 Liner) Specialized processing hr 58,460 83,520 -Material fee & Design fee separate General processing hr 36,540 52,200 Design fee (Modeling work) CAM 0.5 hr 10,960 15,660 Modeling (Design) 0.5 hr 10,960 15,660 - Embryo frozen & transplantationEmbryo frozen preservationvariety/month10,22014,610-a fertilized egg 200ea
공용장비이용료 Division Equipment (Model) Analysis Item Unit Fee Remarks UNIST (70%) Client (100%) IVRC IVC Rack cage Mouse breeding Cage․Day 650 – Rat breeding Cage․Day 980 – Isolation-Mouse breeding Cage․Day 1,300 – Isolation-Rat breeding Cage․Day 1,960 – Anesthesia perscription per case 5,220 – Issuance of veterinary prescriptions Basic experiment others. Disease Model Production hr 31,320 – Change of item name: From ‘Tumor Model Production’ to ‘Disease Model Production’ Other surgeries and experimental support hr 31,320 – Embryo frozen distribution per animal 51,150 73,080 basic 2pairs Embryo transplantation variety 365,400 522,000 Including Microbial Monitoring, Excluding Transportation Fees Animal purification variety 803,880 1,148,400 Provision of Offspring at 4 Weeks after Surrogate Embryo Transfer (Includes Microbial Monitoring, Excludes Transportation Fees) Behavioral analysis equipment Video analysis hr 9,290 13,360 Evaluation of motor sensory function hr 9,290 13,360 Behavior analysis lab Space usage fee hr 6,870 9,810 Histopathology equipment Tissue-processor sample 43,840 62,640 Paraffin embedding center hr 5,100 7,300 Microtome hr 6,570 9,390 Cryostat hr 6,570 9,390 H&E staining sample 33,610 48,020 In vivo imaging analysis equipment MRI hr 111,080 158,680 micro CT hr 43,840 62,640 In vivo optical Imaging system hr 51,150 73,080 Data analysis fee (Optical Imaging System) hr – 10,440 -
공용장비이용료 Division Equipment (Model) Analysis Item Unit Fee Remarks UNIST (70%) Client (100%) UOBC Confocal SIM Scan (FV1000) Imaging Analysis hr 36,540 52,200 ZDC Mircoscope (Cell R) Imaging Analysis hr 21,920 31,320 TIFRM System (Cell TIRFM) Imaging Analysis hr 51,150 73,080 Virtual Microscopy (DOT/SLID) Imaging Analysis hr 14,610 20,880 Confocal Microscopy (FV10i) Imaging Analysis hr 21,920 31,320 Inverted Microscopy (IX-71) Imaging Analysis hr 14,610 20,880 Bio Imaging Navigator (FSX-100) Phase, Fluorescent image Analysis hr 14,610 20,880 Macroview (MVX10) Fluorescent image Analysis hr 14,610 20,880 MetaMorph /AutoQuantX Imaging Analysis software – 3,650 3,650 Imaging Analysis 1 (ZEN, Imaris 8.0, MM, AQ) Imaging Analysis software – 3,650 3,650 Imaging Analysis 2 (ZEN, Imaris 9.6) Imaging Analysis software – 3,650 3,650 Lightsheet Analysis (Arivis, Imaris 9.6) Imaging Analysis software – 3,650 3,650 Super Resolution Microscope (SIM) Imaging Analysis hr 73,080 104,400 Super Resolution Microscope (PLAM) Imaging Analysis hr 73,080 104,400 Calcium Imaging Microscope System Imaging Analysis hr 21,920 31,320 Multi-Photon Microscopy Imaging Analysis hr 73,080 104,400 Laser Capture Microdissection Imaging Analysis hr 21,920 31,320 Multi-Photon Confocal (LSM780NLO) Imaging Analysis hr 73,080 104,400 Super Resolution (SIM & PALM) Imaging Analysis hr 73,080 104,400 Light Sheet Microscope Imaging Analysis hr 73,080 104,400 High Sensitive and Multiplex 980 Imaging Analysis hr 73,080 104,400 Spectral and Live Cell Confocal (LSM780) Imaging Analysis hr 58,460 83,520 -
공용장비이용료 Division Equipment (Model) Analysis Item Unit Fee Remarks UNIST (70%) Client (100%) USRRC UNIST-PAL Beamline XAFS
SAXS
WAXD
GI-WAXD
Crystallography
self-use
(24hr)310,050 – request
(8hr)– 1,879,200