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공용장비이용료 Category Equipment(Model) Item Unit Charge Remark UNIST Self UNIST Request Self Request Electron Microscopy Advanced TEM(Titan G2 Cube 60-300) TEM hr 219,200 306,900 438,500 CS-STEM(JEM-ARM300F) TEM, STEM, EDS, EELS 164,400 230,200 328,900 o Grid : 10,000 HR-TEM(JEM-2100F) Imaging, STEM, EDS 102,300 219,200 146,200 313,200 Normal-TEM(JEM-2100) Imaging 51,200 109,600 73,100 156,600 Quanta 3D FIB(Quanta 3D FEG) Milling, Image, TEM Sample preparation 102,300 219,200 146,200 313,200 o Mo grid : 40,000 KRW o Gel pack : 20,000 KRW EBSD 30,700 65,800 43,800 94,000 Helios 450HP FIB(Helios 450 HP) Milling, Image, TEM Sample preparation 109,600 153,500 219,200 o Mo grid : 40,000 KRW o Gel pack : 20,000 KRW SU7000 FE-SEM(SU7000 SEM) Imaging, EDS 39,900 85,500 57,000 122,100 SU8220 Cold FE-SEM (SU8220 Cold SEM) Cold FE-SEM(S4800 Cold SEM) 30,700 65,800 43,800 94,000 Quanta200 FE-SEM (Quanta200 SEM) 25,600 54,800 36,500 78,300 Electron Microscopy Sample Preparation Advanced Plasma System Cleaning sample 5,100 11,000 7,300 15,700 Dimple Grinder Dimpling hr 2,600 5,500 3,700 7,800 Hitachi Sputter Sputtering sample 5,100 11,000 7,300 15,700 Inverted Metallurgical Microscope Imaging hr Ion Milling System Milling 12,800 27,400 18,300 39,200 Low Angle Ion Mill 10,200 21,900 14,600 31,300 Low Speed Saw(Techcut4) Sawing 3,600 7,700 5,100 11,000 Mechanical Polishing System(Metprep3) Polishing 5,100 11,000 7,300 15,700 Mechanical Polishing System(Multiprep) Mounting Press Mounting sample 10,200 21,900 14,600 31,300 Plunge Freezer TEM Sample preparation hr 25,600 54,800 36,500 78,300 Ultramicrotome(RMC CR-X) SEM Sample preparation sample 35,800 76,700 51,200 109,600 TEM Sample preparation 51,200 109,600 73,100 156,600 SEM Sample preparation(Cryo) 66,500 142,500 95,000 203,600 TEM Sample preparation(Cryo) 102,300 219,200 146,200 313,200 X-ray Analysis High Power XRD(D/MAX2500V/PC) Powder Phase Analysis hr 25,600 54,800 36,500 78,300 High Resolution XRD(D8 Discover) Film Phase Analysis High Resolution Powder XRD Cu Kalpha1 Phase Analysis 51,200 109,600 73,100 156,600 Multi-purpose High Power XRD(Smart Lab XE) Phase Analysis, In-situ 25,600 54,800 36,500 78,300 In-Situ Gas: Actual expense Normal XRD(D8 Advance) Phase Analysis 12,800 27,400 18,300 39,200 High Resolution X-ray Diffractometer(New) Film Phase Analysis 25,600 54,800 36,500 78,300 Spectroscopic Analysis Varian 600MHz NMR (Solid-state NMR) 1H (or 20 min) sample 18,100 25,300 36,200 Overnight experiment(50% discount) 13C CP-MAS 1.5hr 81,400 113,900 162,700 13C DP-MAS 3hr 162,700 227,800 325,500 Solid (other) hr 54,300 76,000 108,500 Overnight (50%) 16hr 433,900 607,500 867,900 Sample preparation(Rotor) sample 42,000 58,800 84,000 sample preparation: actual expense(80,000 KRW), For more information, please consult the equipment manager separately Bruker Cryogenic 600MHz NMR(Solution NMR) 1H (or 20 min) 11,300 24,100 16,100 34,400 o Cryogenic 600 NMR : 2-3 times higher sensitivity compared to the existing 600 NMR
ex) 400/1hr = 600/18min = Cryo 600/5min
o Sample tube (400 MHz)
1) WG-1000: 6,000 KRW 2) WG-1228: 11,000 KRW 3) WG-535-PP: 50,000 KRW
o Sample tube (600 MHz)1) WG-1000: 6,000 KRW 2) WG-1241: 20,000 KRW 3) WG-535-PP: 50,000 KRW
o NMR solvent 1) D2O, CDCl3: 6,000 KRW 2) DMSO-D6: 20,000 KRW 3) D2O4, TFA-D: 20,000 KRW
4) THF-D8, DMF-D7: 40,000 KRW 5) Others: Actual expense settlement· Special experiment: Temperature experiment, 2D NMR, etc.13C hr 33,800 72,300 48,200 103,300 Special Experiment Bruker 400MHz NMR(Solution NMR) 1H (or 20 min) sample 6,100 13,100 8,800 18,800 o Cryogenic 600 NMR : 2-3 times higher sensitivity compared to the existing 600 NMR
ex) 400/1hr = 600/18min = Cryo 600/5min
o Sample tube (400 MHz)
1) WG-1000: 6,000KRW 2) WG-1228: 11,000KRW 3) WG-535-PP: 50,000KRW
o Sample tube (600 MHz)
1) WG-1000: 6,000KRW 2) WG-1241: 20,000KRW 3) WG-535-PP: 50,000KRW
o NMR solvent
1) D2O, CDCl3: 6,000KRW 2) DMSO-D6: 20,000KRW 3) D2O4, TFA-D: 20,000KRW
4) THF-D8, DMF-D7: 40,000KRW 5) Others: Actual expense settlement· Special experiment: Temperature experiment, 2D NMR, etc.13C hr 18,400 39,500 26,300 56,400 FT-IR(670-IR/620-IR) Main body (ATR) hr/sample 5,100 11,000 7,300 15,700 In cases where sample analysis (e.g., foreign substance detection) takes longer than usual, an additional fee of 50% of the basic rate will be charged per extra hour. Main body (acc.) 7,700 16,400 11,000 23,500 Microscope 10,200 21,900 14,600 31,300 Surface Analysis Confocal Raman(Alpha300R) Element Analysis hr 12,800 27,400 18,300 39,200 AFM-Raman(Alpha300S) Spectroscopic Analysis UV-Vis-NIR(Cary 5000) %T, Abs 6,400 13,700 9,100 19,600 Reflectance measurement Using ACC(%R) hr/ea 12,800 27,400 18,300 39,200 UV-Vis-NIR Microspectrometer(20/20 PV) Abs, %T, %R 13,300 28,500 19,000 40,700 Fluorometer(Cary Eclipse) Fluoroscence analysis 10,200 21,900 14,600 31,300 Spectrofluorometer(FP-8500ST) Quantum yield hr 12,800 27,400 18,300 39,200 Zeta Potential(Nano ZS) Potential measurement, size measurement 13,300 28,500 19,000 40,700 o additional fee for each cell ESR(EMXplus) Room temperature hr/ea 25,600 54,800 36,500 78,300 o Sample preparation: actual expense Cryo mode 35,800 76,700 51,200 109,600 Surface Analysis XPS(K-alpha) Qualitative Sample 32,900 46,000 65,800 Basically, a measurement that does not exceed 1 hour is considered one sample. When exceeding 1 hour, an external fee of 60,000 won/hour is added. Depth 65,800 92,100 131,500 UPS(Escalab230) Surface Analysis hr/sample 46,000 98,700 65,800 140,900 Basically, a measurement that does not exceed 1 hour is considered one sample. When exceeding 1 hour, an external fee of 60,000 won/hour is added. Depth profile 76,700 164,400 109,600 234,900 AFM(MultimodeV) Surface analysis & multi mode hr 25,600 54,800 36,500 78,300 AFM(Dimension, Ikon) 27,400 38,400 54,800 TOF-SIMS(TOF SIMS 5) Surface Analysis sample 38,400 53,700 76,700 o A standard fee applies to each request(109,600 KRW)
o Additional costs apply if exceeding 1hour -additional cost incurred for data reprocessingPhysisorption Analyzer(ASAP 2420, 2020) surface area, etc (meso pore) 40,900 87,700 58,500 125,300 surface area, etc (micro pore) 51,200 109,600 73,100 156,600 Mass Analysis MALDI-TOF/TOF(autoflex Max) MS sample 15,300 32,900 21,900 47,000 Billed per hour (30 minutes) for self-user MS/MS 30,700 65,800 43,800 94,000 HPLC(1200 series) LC/VWD 35,800 76,700 51,200 109,600 GPC/MALS(Agilent 1200S miniDAWN TREOS) GPC 15,300 32,900 21,900 47,000 Sample preparation 5,200 KRW MALS 43,500 93,200 62,100 133,100 GCMS SYSTEM(Agilent 5977C/8890) GC/MS 30,700 65,800 43,800 94,000 Pyrolysis: 20,900 KRW DART-HRMS(AccuTOF 4G+ DART) ESI, DART 16,400 23,000 32,900 HR mode 5,500 7,700 11,000 UPLC/Q-TOF-MS(Xevo G2 Q-TOF) HRMS 16,400 23,000 32,900 MS/MS 32,900 46,000 65,800 LC/MS 54,800 76,700 109,600 LC/MS/MS 65,800 92,100 131,500 UPLC 27,400 38,400 54,800 Element Analyzer(Flash 2000) C,H,N,S analysis(3ea) 20,500 43,800 29,200 62,600 LC/MS/MS(Orbitrap Elite,Q Exactive plus) Protein Identify 164,400 230,200 328,900 Protein Identify (Shot-gun) 493,300 690,600 986,600 Phophopeptide Site Determination 98,700 138,100 197,300 In-Gel Digestion 27,400 38,400 54,800 1D SDS-PAGE Mini Gel / Silver Staining Gel 54,800 76,700 109,600 1D SDS-PAGE Mini Gel / Colloidal Staining 43,800 61,400 87,700 1D SDS-PAGE Gradient Gel / Silver Staining 109,600 153,500 219,200 1D SDS-PAGE Gradient Gel / Colloidal Staining 98,700 138,100 197,300 ESI MS sample 21,900 30,700 43,800 Thermal & Physical Analysis Thermal Analysis(TA Q200, Q600, Q800, Q500) Thermal analysis(2hr) 15,300 32,900 21,900 47,000 additional time hr 2,600 5,500 3,700 7,800 Low temperature use(Q800) sample 5,100 11,000 7,300 15,700 Dilatometry Thermal analysis sample 25,600 54,800 36,500 78,300 Includes 3 hours of measurement; 10,000 KRW per additional hour. Seebeck Coefficient Analyzer(SBA458) Seebeck coefficient, electrical conductivity 10,200 21,900 14,600 31,300 Includes 3 hours of measurement; 5,000 KRW per additional hour. Rheometer(Haake Mars 3) Measurement of physical properties 2hr 20,500 43,800 29,200 62,600 additional time hr 2,600 5,500 3,700 7,800 Environmental Analysis GC/HRMS(UF 800 D, 800 D,700) HRMS Sample 164,400 230,200 328,900 Please contact the equipment manager in advance GC/MS(Agilent 7890A/5975C) GC/MS 30,700 65,800 43,800 94,000 GC/MS/MS(7010B Triple Quadrupole GC/MS) GC/MS/MS 46,000 98,700 65,800 140,900 ICP-TQ-MS(Nexion 5000) Element Analysis 27,400 38,400 54,800 For additional element, 5,500 KRW (1 element) Pre-treatment 16,400 23,000 32,900 GC/ECD(7890A/micro-ECD) GC 27,400 38,400 54,800 LC/MS/MS(Xevo TQ-S) Quantative analysis 54,800 76,700 109,600 ICP-OES(720-ES) Element Analysis 13,700 19,200 27,400 For additional element, 3,300 KRW (3 elements) Pre-treatment(Acid) 16,400 23,000 32,900 Pre-treatment(Fusion) 32,900 46,000 65,800 ICP-OES(iCAP Pro) Element Analysis 13,700 19,200 27,400 For additional element, 3,300 KRW (3 elements) Pre-treatment(Acid) 16,400 23,000 32,900 Pre-treatment(Fusion) 32,900 46,000 65,800 2D GC/TOF-MS (Pegasus 4D GCxGC system) GC 30,700 65,800 43,800 94,000 2D GC 51,200 109,600 73,100 156,600 (Pohang)6D UNIST-PAL XAFS, SAXS, WAXD, GI-WAXD, Crystallography Self 24hr 325,600 Request 8hr 1,973,200 Electron Microscopy Advanced TEM(Titan G2 Cube 60-300) TEM hr 219,200 306,900 438,500 CS-STEM(JEM-ARM300F) TEM, STEM, EDS, EELS hr 164,400 230,200 328,900 o Grid : 10,000 HR-TEM(JEM-2100F) Imaging, STEM, EDS hr 102,300 219,200 146,200 313,200 o Grid : 10,000 Normal-TEM(JEM-2100) Imaging hr 51,200 109,600 73,100 156,600 Quanta 3D FIB(Quanta 3D FEG) Milling, Image, TEM Sample preparation hr 102,300 219,200 146,200 313,200 o Mo grid : 40,000 KRW o Gel pack : 20,000 KRW Quanta 3D FIB(Quanta 3D FEG) EBSD hr 30,700 65,800 43,800 94,000 Helios 450HP FIB(Helios 450 HP) Milling, Image, TEM Sample preparation hr 109,600 153,500 219,200 o Mo grid : 40,000 KRW o Gel pack : 20,000 KRW SU7000 FE-SEM(SU7000 SEM) Imaging, EDS hr 39,900 85,500 57,000 122,100 SU8220 Cold FE-SEM (SU8220 Cold SEM) Imaging, EDS hr 39,900 85,500 57,000 122,100 Cold FE-SEM(S4800 Cold SEM) Imaging, EDS hr 30,700 65,800 43,800 94,000 Quanta200 FE-SEM (Quanta200 SEM) Imaging, EDS hr 25,600 54,800 36,500 78,300 Electron Microscopy Sample Preparation Advanced Plasma System Cleaning sample 5,100 11,000 7,300 15,700 Dimple Grinder Dimpling hr 2,600 5,500 3,700 7,800 Hitachi Sputter Sputtering sample 5,100 11,000 7,300 15,700 Inverted Metallurgical Microscope Imaging hr 5,100 11,000 7,300 15,700 Ion Milling System Milling hr 12,800 27,400 18,300 39,200 Low Angle Ion Mill Milling hr 10,200 21,900 14,600 31,300 Low Speed Saw(Techcut4) Sawing hr 3,600 7,700 5,100 11,000 Mechanical Polishing System(Metprep3) Polishing hr 5,100 11,000 7,300 15,700 Mechanical Polishing System(Multiprep) Polishing hr 5,100 11,000 7,300 15,700 Mounting Press Mounting sample 10,200 21,900 14,600 31,300 Plunge Freezer TEM Sample preparation hr 25,600 54,800 36,500 78,300 Ultramicrotome(RMC CR-X) SEM Sample preparation sample 35,800 76,700 51,200 109,600 Ultramicrotome(RMC CR-X) TEM Sample preparation sample 51,200 109,600 73,100 156,600 Ultramicrotome(RMC CR-X) SEM Sample preparation(Cryo) sample 66,500 142,500 95,000 203,600 Ultramicrotome(RMC CR-X) TEM Sample preparation(Cryo) sample 102,300 219,200 146,200 313,200 X-ray Analysis High Power XRD(D/MAX2500V/PC) Powder Phase Analysis hr 25,600 54,800 36,500 78,300 High Resolution XRD(D8 Discover) Film Phase Analysis hr 25,600 54,800 36,500 78,300 High Resolution Powder XRD Cu Kalpha1 Phase Analysis hr 51,200 109,600 73,100 156,600 Multi-purpose High Power XRD(Smart Lab XE) Phase Analysis, In-situ hr 25,600 54,800 36,500 78,300 In-Situ Gas: Actual expense Normal XRD(D8 Advance) Phase Analysis hr 12,800 27,400 18,300 39,200 High Resolution X-ray Diffractometer(New) Film Phase Analysis hr 25,600 54,800 36,500 78,300 Spectroscopic Analysis Varian 600MHz NMR (Solid-state NMR) 1H (or 20 min) sample 18,100 25,300 36,200 Overnight experiment(50% discount) Varian 600MHz NMR (Solid-state NMR) 13C CP-MAS 1.5hr 81,400 113,900 162,700 Varian 600MHz NMR (Solid-state NMR) 13C DP-MAS 3hr 162,700 227,800 325,500 Varian 600MHz NMR (Solid-state NMR) Solid (other) hr 54,300 76,000 108,500 Varian 600MHz NMR (Solid-state NMR) Overnight (50%) 16hr 433,900 607,500 867,900 Varian 600MHz NMR (Solid-state NMR) Sample preparation(Rotor) sample 42,000 58,800 84,000 sample preparation: actual expense(80,000 KRW), For more information, please consult the equipment manager separately Bruker Cryogenic 600MHz NMR(Solution NMR) 1H (or 20 min) sample 11,300 24,100 16,100 34,400 o Cryogenic 600 NMR : 2-3 times higher sensitivity compared to the existing 600 NMR
ex) 400/1hr = 600/18min = Cryo 600/5min
o Sample tube (400 MHz)
1) WG-1000: 6,000 KRW 2) WG-1228: 11,000 KRW 3) WG-535-PP: 50,000 KRW
o Sample tube (600 MHz)1) WG-1000: 6,000 KRW 2) WG-1241: 20,000 KRW 3) WG-535-PP: 50,000 KRW
o NMR solvent 1) D2O, CDCl3: 6,000 KRW 2) DMSO-D6: 20,000 KRW 3) D2O4, TFA-D: 20,000 KRW
4) THF-D8, DMF-D7: 40,000 KRW 5) Others: Actual expense settlement· Special experiment: Temperature experiment, 2D NMR, etc.Bruker Cryogenic 600MHz NMR(Solution NMR) 13C hr 33,800 72,300 48,200 103,300 Bruker Cryogenic 600MHz NMR(Solution NMR) Special Experiment hr 33,800 72,300 48,200 103,300 Bruker 400MHz NMR(Solution NMR) 1H (or 20 min) sample 6,100 13,100 8,800 18,800 o Cryogenic 600 NMR : 2-3 times higher sensitivity compared to the existing 600 NMR
ex) 400/1hr = 600/18min = Cryo 600/5min
o Sample tube (400 MHz)
1) WG-1000: 6,000KRW 2) WG-1228: 11,000KRW 3) WG-535-PP: 50,000KRW
o Sample tube (600 MHz)
1) WG-1000: 6,000KRW 2) WG-1241: 20,000KRW 3) WG-535-PP: 50,000KRW
o NMR solvent
1) D2O, CDCl3: 6,000KRW 2) DMSO-D6: 20,000KRW 3) D2O4, TFA-D: 20,000KRW
4) THF-D8, DMF-D7: 40,000KRW 5) Others: Actual expense settlement· Special experiment: Temperature experiment, 2D NMR, etc.Bruker 400MHz NMR(Solution NMR) 13C hr 18,400 39,500 26,300 56,400 FT-IR(670-IR/620-IR) Main body (ATR) hr/sample 5,100 11,000 7,300 15,700 In cases where sample analysis (e.g., foreign substance detection) takes longer than usual, an additional fee of 50% of the basic rate will be charged per extra hour. FT-IR(670-IR/620-IR) Main body (acc.) hr/sample 7,700 16,400 11,000 23,500 FT-IR(670-IR/620-IR) Microscope hr/sample 10,200 21,900 14,600 31,300 Surface Analysis Confocal Raman(Alpha300R) Element Analysis hr 12,800 27,400 18,300 39,200 AFM-Raman(Alpha300S) Element Analysis hr 12,800 27,400 18,300 39,200 Spectroscopic Analysis UV-Vis-NIR(Cary 5000) %T, Abs hr 6,400 13,700 9,100 19,600 UV-Vis-NIR(Cary 5000) Reflectance measurement Using ACC(%R) hr/ea 12,800 27,400 18,300 39,200 UV-Vis-NIR Microspectrometer(20/20 PV) Abs, %T, %R hr/ea 13,300 28,500 19,000 40,700 Fluorometer(Cary Eclipse) Fluoroscence analysis hr/ea 10,200 21,900 14,600 31,300 Spectrofluorometer(FP-8500ST) Quantum yield hr 12,800 27,400 18,300 39,200 Zeta Potential(Nano ZS) Potential measurement, size measurement hr 13,300 28,500 19,000 40,700 o additional fee for each cell ESR(EMXplus) Room temperature hr/ea 25,600 54,800 36,500 78,300 o Sample preparation: actual expense ESR(EMXplus) Cryo mode 35,800 76,700 51,200 109,600 Surface Analysis XPS(K-alpha) Qualitative Sample 32,900 46,000 65,800 Basically, a measurement that does not exceed 1 hour is considered one sample. When exceeding 1 hour, an external fee of 60,000 won/hour is added. XPS(K-alpha) Depth Sample 65,800 92,100 131,500 UPS(Escalab230) Surface Analysis hr/sample 46,000 98,700 65,800 140,900 Basically, a measurement that does not exceed 1 hour is considered one sample. When exceeding 1 hour, an external fee of 60,000 won/hour is added. UPS(Escalab230) Depth profile hr/sample 76,700 164,400 109,600 234,900 AFM(MultimodeV) Surface analysis & multi mode hr 25,600 54,800 36,500 78,300 AFM(Dimension, Ikon) Surface analysis & multi mode hr 27,400 38,400 54,800 TOF-SIMS(TOF SIMS 5) Surface Analysis sample 38,400 53,700 76,700 o A standard fee applies to each request(109,600 KRW)
o Additional costs apply if exceeding 1hour -additional cost incurred for data reprocessingPhysisorption Analyzer(ASAP 2420, 2020) surface area, etc (meso pore) sample 40,900 87,700 58,500 125,300 Physisorption Analyzer(ASAP 2420, 2020) surface area, etc (micro pore) sample 51,200 109,600 73,100 156,600 Mass Analysis MALDI-TOF/TOF(autoflex Max) MS sample 15,300 32,900 21,900 47,000 Billed per hour (30 minutes) for self-user MALDI-TOF/TOF(autoflex Max) MS/MS sample 30,700 65,800 43,800 94,000 Billed per hour (30 minutes) for self-user HPLC(1200 series) LC/VWD sample 35,800 76,700 51,200 109,600 GPC/MALS(Agilent 1200S miniDAWN TREOS) GPC sample 15,300 32,900 21,900 47,000 Sample preparation 5,200 KRW GPC/MALS(Agilent 1200S miniDAWN TREOS) MALS sample 43,500 93,200 62,100 133,100 GCMS SYSTEM(Agilent 5977C/8890) GC/MS sample 30,700 65,800 43,800 94,000 Pyrolysis: 20,900 KRW DART-HRMS(AccuTOF 4G+ DART) ESI, DART sample 16,400 23,000 32,900 DART-HRMS(AccuTOF 4G+ DART) HR mode sample 5,500 7,700 11,000 UPLC/Q-TOF-MS(Xevo G2 Q-TOF) HRMS sample 16,400 23,000 32,900 UPLC/Q-TOF-MS(Xevo G2 Q-TOF) MS/MS sample 32,900 46,000 65,800 UPLC/Q-TOF-MS(Xevo G2 Q-TOF) LC/MS sample 54,800 76,700 109,600 UPLC/Q-TOF-MS(Xevo G2 Q-TOF) LC/MS/MS sample 65,800 92,100 131,500 UPLC/Q-TOF-MS(Xevo G2 Q-TOF) UPLC sample 27,400 38,400 54,800 Element Analyzer(Flash 2000) C,H,N,S analysis(3ea) sample 20,500 43,800 29,200 62,600 LC/MS/MS(Orbitrap Elite,Q Exactive plus) Protein Identify sample 164,400 230,200 328,900 LC/MS/MS(Orbitrap Elite,Q Exactive plus) Protein Identify (Shot-gun) sample 493,300 690,600 986,600 LC/MS/MS(Orbitrap Elite,Q Exactive plus) Phophopeptide Site Determination sample 98,700 138,100 197,300 LC/MS/MS(Orbitrap Elite,Q Exactive plus) In-Gel Digestion sample 27,400 38,400 54,800 LC/MS/MS(Orbitrap Elite,Q Exactive plus) 1D SDS-PAGE Mini Gel / Silver Staining Gel 54,800 76,700 109,600 LC/MS/MS(Orbitrap Elite,Q Exactive plus) 1D SDS-PAGE Mini Gel / Colloidal Staining Gel 43,800 61,400 87,700 LC/MS/MS(Orbitrap Elite,Q Exactive plus) 1D SDS-PAGE Gradient Gel / Silver Staining Gel 109,600 153,500 219,200 LC/MS/MS(Orbitrap Elite,Q Exactive plus) 1D SDS-PAGE Gradient Gel / Colloidal Staining Gel 98,700 138,100 197,300 LC/MS/MS(Orbitrap Elite,Q Exactive plus) ESI MS sample 21,900 30,700 43,800 Thermal & Physical Analysis Thermal Analysis(TA Q200, Q600, Q800, Q500) Thermal analysis(2hr) sample 15,300 32,900 21,900 47,000 Thermal Analysis(TA Q200, Q600, Q800, Q500) additional time hr 2,600 5,500 3,700 7,800 Thermal Analysis(TA Q200, Q600, Q800, Q500) Low temperature use(Q800) sample 5,100 11,000 7,300 15,700 Dilatometry Thermal analysis sample 25,600 54,800 36,500 78,300 Includes 3 hours of measurement; 10,000 KRW per additional hour. Seebeck Coefficient Analyzer(SBA458) Seebeck coefficient, electrical conductivity sample 10,200 21,900 14,600 31,300 Includes 3 hours of measurement; 5,000 KRW per additional hour. Rheometer(Haake Mars 3) Measurement of physical properties 2hr 20,500 43,800 29,200 62,600 Rheometer(Haake Mars 3) additional time hr 2,600 5,500 3,700 7,800 Environmental Analysis GC/HRMS(UF 800 D, 800 D,700) HRMS Sample 164,400 230,200 328,900 Please contact the equipment manager in advance GC/MS(Agilent 7890A/5975C) GC/MS Sample 30,700 65,800 43,800 94,000 GC/MS/MS(7010B Triple Quadrupole GC/MS) GC/MS/MS Sample 46,000 98,700 65,800 140,900 ICP-TQ-MS(Nexion 5000) Element Analysis Sample 27,400 38,400 54,800 For additional element, 5,500 KRW (1 element) ICP-TQ-MS(Nexion 5000) Pre-treatment Sample 16,400 23,000 32,900 GC/ECD(7890A/micro-ECD) GC Sample 27,400 38,400 54,800 LC/MS/MS(Xevo TQ-S) Quantative analysis Sample 54,800 76,700 109,600 ICP-OES(720-ES) Element Analysis Sample 13,700 19,200 27,400 For additional element, 3,300 KRW (3 elements) ICP-OES(720-ES) Pre-treatment(Acid) Sample 16,400 23,000 32,900 ICP-OES(720-ES) Pre-treatment(Fusion) Sample 32,900 46,000 65,800 ICP-OES(iCAP Pro) Element Analysis Sample 13,700 19,200 27,400 For additional element, 3,300 KRW (3 elements) ICP-OES(iCAP Pro) Pre-treatment(Acid) Sample 16,400 23,000 32,900 ICP-OES(iCAP Pro) Pre-treatment(Fusion) Sample 32,900 46,000 65,800 2D GC/TOF-MS (Pegasus 4D GCxGC system) GC Sample 30,700 65,800 43,800 94,000 2D GC/TOF-MS (Pegasus 4D GCxGC system) 2D GC Sample 51,200 109,600 73,100 156,600 (Pohang)6D UNIST-PAL XAFS, SAXS, WAXD, GI-WAXD, Crystallography Self 24hr 325,600 XAFS, SAXS, WAXD, GI-WAXD, Crystallography Request 8hr 1,973,200 -
공용장비이용료 Category Equipment(Model) Item Unit Charge Remark UNIST Self UNIST Request Self Request Manufacturing CNC 5-Axis Machining(C40U) (2대) Precision processing hr 38,400 53,700 76,700 CNC 3-Axis Machining(B300V) 27,400 38,400 54,800 CNC late(TPL-6) Precision Cylindrical processing 16,400 23,000 32,900 Lathe(TIPL-410) Cylindrical processing 7,700 16,400 11,000 23,500 Vertical Milling Machine(STM-2VM) plane processing Band Saw Machine(KDBS 320M) cutting ea 2,600 5,500 3,700 7,800 Coordinate Measuring Machine(pgs) Precision measurement hr 12,800 27,400 18,300 39,200 Three-Dimensional Measurement(NV-3000) 3D measurement Semi Auto FormtracerSystem(SV-C3100) Precision measurement 0.5hr 10,200 21,900 14,600 31,300 Mult-Component Dynamometer(2825A) hr 11,000 15,300 21,900 Laser Interferometer(XL-80) Powerful Microscope(MF-1010B) 0.5hr 10,200 21,900 14,600 31,300 Bench Drilling Machine(MD-360) Hole processing ea 2,600 5,500 3,700 7,800 Plotter(HP Z6200) Paper 27,400 38,400 54,800 A0 size Fabric 31,300 43,900 62,700 Universal Testing Machine(AGS-100NX) Precision measurement hr 10,200 21,900 14,600 31,300 Electron-Beam PIKA Machine(PF32B) Precision processing 27,400 38,400 54,800 Ultra- Precision Nano Machine(FANUC ROBONANO α – 0iB) 2hr 65,800 92,100 131,500 3D Print(x500pro) Prototype ea 27,400 38,400 54,800 Laser Cutting Machine(K2CMS1) Precision cutting 0.5hr 16,400 23,000 32,900 3D Scanner(REXCAN DS2) Precision measurement 10,200 21,900 14,600 31,300 Non-contact 3D Scanner(REXCAN4) Wire-Cut EDM(SL400G) Precision cutting hr 21,900 30,700 43,800 Welding(350A) product joining 0.5hr 8,200 11,500 16,400 CNC Multi Tasking Machine(NTX 1000) Turning/milling processing hr 32,900 46,000 65,800 ULTRASONIC Machine Specialized processing 43,800 61,400 87,700 Brittle materials General processing 27,400 38,400 54,800 3D Laser Microscope(VK-X3050) Precision measurement 54,800 76,700 109,600 Design fee (Modeling work) CAM, Modeling(Design) 0.5hr 7,700 16,400 11,000 23,500 Fabrication E-beam lithography(NB3) Process 2hr 164,400 230,200 328,900 o Additional fee: 87,700 KRW per 0.5hour
o Pattern should be prepared by a user
o Basic ER/PR and Chemical supplied (AR-P 6200.09, AR-P 671.04, AR-N 7520.18, AR 600-546, AR 300-71, AR 300-46)
o Full wafer and conductive resist coating would be charged for addional fee
o Free for Data consulting, Job file making, e-beam resist coating, baking and developE-beam lithography#2(Attach) 30min 25,600 54,800 36,500 78,300 o A user should prepare ‘Pattern’
o basic ER/PR and Chemical supplied (AR-P 6200.09, AR-P 671.04, AR-N 7520.18, AR 600-546, AR 300-71, AR 300-46)
o Free for Data consulting, Job file making, e-beam resist coating, baking and developPhoto lithography(MA6#1,#2) 15,300 32,900 21,900 47,000 o Basic PR and chemical supplied (GXR601, DPRi-1549, AZ5214, AZ4330, nLOF2035, MIF300)
o free for Spin coater, Wet Station, Oven, Hot plate
o using personal materials (PR): 1,800won/30min discountPhoto lithography(MDA400S) 12,800 27,400 18,300 39,200 o Basic PR and chemical supplied (GXR601, DPRi-1549, AZ5214, AZ4330, nLOF2035, MIF300)
o Free for Spin coater, Wet Station, Oven, Hot plate
o using personal materials (PR): 1,800won/30min discountLaser lithography(Picomaster200) 25,600 54,800 36,500 78,300 Deep Si Etcher(Tegal200) 38,400 82,200 54,800 117,500 o Additional fee (more than 100 μm)
– 52,200 KRW for 100 μmDielectric RIE(Labstar) 15,300 32,900 21,900 47,000 Please contact the equipment manager for more than 30 mins Dielectric ICP-RIE(FABstar) 23,000 49,300 32,900 70,500 Metal ICP-RIE#1(FABstar) Metal ICP-RIE#2(Oxford) CCP etcher 1 time 127,900 274,100 182,700 391,500 Plasma PR Stripper(PTP300) 20,500 43,800 29,200 62,600 Plasma Treatment System(V15-G) 30min 5,100 10,900 7,300 15,600 Wet Station(WetStation) 7,700 16,400 11,000 23,500 E-beam evaporator#1(Temescal_FC-2000) 1time ≤ 300nm 49,300 69,100 98,700 o Additional fee
– A user should prepare for special metal or crucible himself
– for each ‘300 nm’, addiitional 1ea fee
– Layer : 49,300 KRW
– please contact the equipment manager in advance for othersE-beam Evaporator#2(WC-4000) 46,000 98,700 65,800 140,900 o Additional fee
– A user should prepare for special metal or crucible himself
– for each ‘300 nm’, addiitional 1ea fee
– Layer : 47,000 KRW
– please contact the equipment manager in advance for othersDC Sputter(SRN-120) 1time ≤ 300 nm 30,700 65,800 43,800 94,000 o Additional fee
– additional 100nm : 10,400 KRW
– Temperature: 100℃ / 31,500 KRW
– Layer: 31,500 KRWRF Sputter(SRN-120) 1time ≤ 30 min 46,000 98,700 65,800 140,900 o Additional fee
– additional 100nm : 10,400 KRW
– Temperature: 100℃ / 31,500 KRW
– Layer: 31,500 KRWHSC Sputter(SRN130)-DC 1time ≤ 300 nm 30,700 65,800 43,800 94,000 HSC Sputter(SRN130)-RF 46,000 98,700 65,800 140,900 PE CVD#1,#2(PEH-600) 1 time o SiO2 ≤ 1um
o Si3N4 ≤ 0.5 umPE CVD#3(FABStar-PECVD) o Standard: 0.3 ㎛ LP CVD_Poly/Nitride (KVL206) 1 Batch(25pieces) 153,500 328,900 219,200 469,800 LP CVD_TEOS (VULCAN-V61RL) Auto Parylene Coating system (NRPC-500) 1 time 51,200 109,600 73,100 156,600 Atomic layer deposition(LucidaD100) 76,700 164,400 109,600 234,900 o Additional fee (more than 100Å)
– 41,800 KRW/50ÅAtomic layer deposition(AtomicpremiumCN1) Furnace(KHD-306) 1 Batch(25pieces) 153,500 328,900 219,200 469,800 o Wet oxide :1㎛
o Dry oxide :0.3㎛RTP post-process 30min 25,600 54,800 36,500 78,300 CMP CMP 1 time 51,200 109,600 73,100 156,600 o Additional fee
– more than 1 ㎛ : 104,400 KRWLapping & polishing Lapping & polishing 30,700 65,800 43,800 94,000 o Additional fee
– more than 200 ㎛ : 20,900KRWDicing Saw(NDS-1012) #2 Process 15,300 32,900 21,900 47,000 o Additional fee
– Non-pattern : 31,300 KRW
– Pattern : 41,800 KRW
– more than Dicing 30 line : 10,400 KRW
– PR coating : 5,200 KRW / ea
o Glass,Quartz,Si, etc: please contact the equipment manager in advanceWire bonder#1 post-process 1hr 47,000 Wire bonder#2 Normal SEM measurement 30min 10,200 21,900 14,600 31,300 o Additional fee
– Au coating : 10,400 KRW / eaNX2000 FIB(NX2000) Milling, Image, TEM Sample preparation hr 102,300 219,200 146,200 313,200 o Mo grid : 40,000 KRW o Gel pack : 20,000 KRW AFM(NX20) measurement 30min 12,800 27,400 18,300 39,200 Ellipsometer(AR06DM) 10min 3,100 6,600 4,400 9,400 o Additional fee: new material set-up : 10,400 KRW
o Free for long-term admission fee payersThickness Measurement(ST4000-DLX) o Free for long-term admission fee payers Surface Profiler(P-6) Surface & Height 3D profiler Measurement Microscope(AxioScopeA1) 30min 5,100 11,000 7,300 15,700 4-Point Probe System(CMT-SR2000N) 10min 3,100 6,600 4,400 9,400 Probe station 1hr 20,500 43,800 29,200 62,600 o Additional Fee
– Low temperature : 160,000 KRW/8hradmission fee fee by period Day 7,400KRW/DAY, 113,400KRW/1M, 225,800KRW/3M, 399,000KRW/6M Manufacturing CNC 5-Axis Machining(C40U) (2대) Precision processing hr 38,400 53,700 76,700 CNC 3-Axis Machining(B300V) Precision processing hr 27,400 38,400 54,800 CNC late(TPL-6) Precision Cylindrical processing hr 16,400 23,000 32,900 Lathe(TIPL-410) Cylindrical processing hr 7,700 16,400 11,000 23,500 Vertical Milling Machine(STM-2VM) plane processing hr 7,700 16,400 11,000 23,500 Band Saw Machine(KDBS 320M) cutting ea 2,600 5,500 3,700 7,800 Coordinate Measuring Machine(pgs) Precision measurement hr 12,800 27,400 18,300 39,200 Three-Dimensional Measurement(NV-3000) 3D measurement hr 12,800 27,400 18,300 39,200 Semi Auto FormtracerSystem(SV-C3100) Precision measurement 0.5hr 10,200 21,900 14,600 31,300 Mult-Component Dynamometer(2825A) Precision measurement hr 11,000 15,300 21,900 Laser Interferometer(XL-80) Precision measurement hr 11,000 15,300 21,900 Powerful Microscope(MF-1010B) Precision measurement 0.5hr 10,200 21,900 14,600 31,300 Bench Drilling Machine(MD-360) Hole processing ea 2,600 5,500 3,700 7,800 Plotter(HP Z6200) Paper ea 27,400 38,400 54,800 A0 size Plotter(HP Z6200) Fabric ea 31,300 43,900 62,700 Universal Testing Machine(AGS-100NX) Precision measurement hr 10,200 21,900 14,600 31,300 Electron-Beam PIKA Machine(PF32B) Precision processing hr 27,400 38,400 54,800 Ultra- Precision Nano Machine(FANUC ROBONANO α – 0iB) Precision processing 2hr 65,800 92,100 131,500 3D Print(x500pro) Prototype ea 27,400 38,400 54,800 Laser Cutting Machine(K2CMS1) Precision cutting 0.5hr 16,400 23,000 32,900 3D Scanner(REXCAN DS2) Precision measurement 0.5hr 10,200 21,900 14,600 31,300 Non-contact 3D Scanner(REXCAN4) Precision measurement 0.5hr 10,200 21,900 14,600 31,300 Wire-Cut EDM(SL400G) Precision cutting hr 21,900 30,700 43,800 Welding(350A) product joining 0.5hr 8,200 11,500 16,400 CNC Multi Tasking Machine(NTX 1000) Turning/milling processing hr 32,900 46,000 65,800 ULTRASONIC Machine Specialized processing hr 43,800 61,400 87,700 Brittle materials ULTRASONIC Machine General processing hr 27,400 38,400 54,800 3D Laser Microscope(VK-X3050) Precision measurement hr 54,800 76,700 109,600 Design fee (Modeling work) CAM, Modeling(Design) 0.5hr 7,700 16,400 11,000 23,500 Fabrication E-beam lithography(NB3) Process 2hr 164,400 230,200 328,900 o Additional fee: 87,700 KRW per 0.5hour
o Pattern should be prepared by a user
o Basic ER/PR and Chemical supplied (AR-P 6200.09, AR-P 671.04, AR-N 7520.18, AR 600-546, AR 300-71, AR 300-46)
o Full wafer and conductive resist coating would be charged for addional fee
o Free for Data consulting, Job file making, e-beam resist coating, baking and developE-beam lithography#2(Attach) Process 30min 25,600 54,800 36,500 78,300 o A user should prepare ‘Pattern’
o basic ER/PR and Chemical supplied (AR-P 6200.09, AR-P 671.04, AR-N 7520.18, AR 600-546, AR 300-71, AR 300-46)
o Free for Data consulting, Job file making, e-beam resist coating, baking and developPhoto lithography(MA6#1,#2) Process 30min 15,300 32,900 21,900 47,000 o Basic PR and chemical supplied (GXR601, DPRi-1549, AZ5214, AZ4330, nLOF2035, MIF300)
o free for Spin coater, Wet Station, Oven, Hot plate
o using personal materials (PR): 1,800won/30min discountPhoto lithography(MDA400S) Process 30min 12,800 27,400 18,300 39,200 o Basic PR and chemical supplied (GXR601, DPRi-1549, AZ5214, AZ4330, nLOF2035, MIF300)
o Free for Spin coater, Wet Station, Oven, Hot plate
o using personal materials (PR): 1,800won/30min discountLaser lithography(Picomaster200) Process 30min 25,600 54,800 36,500 78,300 o Basic PR and chemical supplied (GXR601, DPRi-1549, AZ5214, AZ4330, nLOF2035, MIF300)
o Free for Spin coater, Wet Station, Oven, Hot plate
o using personal materials (PR): 1,800won/30min discountDeep Si Etcher(Tegal200) Process 30min 38,400 82,200 54,800 117,500 o Additional fee (more than 100 μm)
– 52,200 KRW for 100 μmDielectric RIE(Labstar) Process 30min 15,300 32,900 21,900 47,000 Please contact the equipment manager for more than 30 mins Dielectric ICP-RIE(FABstar) Process 30min 23,000 49,300 32,900 70,500 Please contact the equipment manager for more than 30 mins Metal ICP-RIE#1(FABstar) Process 30min 23,000 49,300 32,900 70,500 Please contact the equipment manager for more than 30 mins Metal ICP-RIE#2(Oxford) Process 30min 23,000 49,300 32,900 70,500 Please contact the equipment manager for more than 30 mins CCP etcher Process 1 time 127,900 274,100 182,700 391,500 Please contact the equipment manager for more than 30 mins Plasma PR Stripper(PTP300) Process 1 time 20,500 43,800 29,200 62,600 Please contact the equipment manager for more than 30 mins Plasma Treatment System(V15-G) Process 30min 5,100 10,900 7,300 15,600 Please contact the equipment manager for more than 30 mins Wet Station(WetStation) Process 30min 7,700 16,400 11,000 23,500 Please contact the equipment manager for more than 30 mins E-beam evaporator#1(Temescal_FC-2000) Process 1time ≤ 300nm 49,300 69,100 98,700 o Additional fee
– A user should prepare for special metal or crucible himself
– for each ‘300 nm’, addiitional 1ea fee
– Layer : 49,300 KRW
– please contact the equipment manager in advance for othersE-beam Evaporator#2(WC-4000) Process 1time ≤ 300nm 46,000 98,700 65,800 140,900 o Additional fee
– A user should prepare for special metal or crucible himself
– for each ‘300 nm’, addiitional 1ea fee
– Layer : 47,000 KRW
– please contact the equipment manager in advance for othersDC Sputter(SRN-120) Process 1time ≤ 300 nm 30,700 65,800 43,800 94,000 o Additional fee
– additional 100nm : 10,400 KRW
– Temperature: 100℃ / 31,500 KRW
– Layer: 31,500 KRWRF Sputter(SRN-120) Process 1time ≤ 30 min 46,000 98,700 65,800 140,900 o Additional fee
– additional 100nm : 10,400 KRW
– Temperature: 100℃ / 31,500 KRW
– Layer: 31,500 KRWHSC Sputter(SRN130)-DC Process 1time ≤ 300 nm 30,700 65,800 43,800 94,000 o Additional fee
– additional 100nm : 10,400 KRW
– Temperature: 100℃ / 31,500 KRW
– Layer: 31,500 KRWHSC Sputter(SRN130)-RF Process 1time ≤ 300 nm 46,000 98,700 65,800 140,900 o Additional fee
– additional 100nm : 10,400 KRW
– Temperature: 100℃ / 31,500 KRW
– Layer: 31,500 KRWPE CVD#1,#2(PEH-600) Process 1 time 46,000 98,700 65,800 140,900 o SiO2 ≤ 1um
o Si3N4 ≤ 0.5 umPE CVD#3(FABStar-PECVD) Process 1 time 46,000 98,700 65,800 140,900 o Standard: 0.3 ㎛ LP CVD_Poly/Nitride (KVL206) Process 1 Batch(25pieces) 153,500 328,900 219,200 469,800 o Standard: 0.3 ㎛ LP CVD_TEOS (VULCAN-V61RL) Process 1 Batch(25pieces) 153,500 328,900 219,200 469,800 o Standard: 0.3 ㎛ Auto Parylene Coating system (NRPC-500) Process 1 time 51,200 109,600 73,100 156,600 Atomic layer deposition(LucidaD100) Process 1 time 76,700 164,400 109,600 234,900 o Additional fee (more than 100Å)
– 41,800 KRW/50ÅAtomic layer deposition(AtomicpremiumCN1) Process 1 time 76,700 164,400 109,600 234,900 o Additional fee (more than 100Å)
– 41,800 KRW/50ÅFurnace(KHD-306) Process 1 Batch(25pieces) 153,500 328,900 219,200 469,800 o Wet oxide :1㎛
o Dry oxide :0.3㎛RTP post-process 30min 25,600 54,800 36,500 78,300 CMP CMP 1 time 51,200 109,600 73,100 156,600 o Additional fee
– more than 1 ㎛ : 104,400 KRWLapping & polishing Lapping & polishing 1 time 30,700 65,800 43,800 94,000 o Additional fee
– more than 200 ㎛ : 20,900KRWDicing Saw(NDS-1012) #2 Process 1 time 15,300 32,900 21,900 47,000 o Additional fee
– Non-pattern : 31,300 KRW
– Pattern : 41,800 KRW
– more than Dicing 30 line : 10,400 KRW
– PR coating : 5,200 KRW / ea
o Glass,Quartz,Si, etc: please contact the equipment manager in advanceWire bonder#1 post-process 1hr 15,300 32,900 21,900 47,000 Wire bonder#2 post-process 1hr 15,300 32,900 21,900 47,000 Normal SEM measurement 30min 10,200 21,900 14,600 31,300 o Additional fee
– Au coating : 10,400 KRW / eaNX2000 FIB(NX2000) Milling, Image, TEM Sample preparation hr 102,300 219,200 146,200 313,200 o Mo grid : 40,000 KRW o Gel pack : 20,000 KRW AFM(NX20) measurement 30min 12,800 27,400 18,300 39,200 Ellipsometer(AR06DM) measurement 10min 3,100 6,600 4,400 9,400 o Additional fee: new material set-up : 10,400 KRW
o Free for long-term admission fee payersThickness Measurement(ST4000-DLX) measurement 10min 3,100 6,600 4,400 9,400 o Free for long-term admission fee payers Surface Profiler(P-6) measurement 10min 3,100 6,600 4,400 9,400 o Free for long-term admission fee payers Surface & Height 3D profiler measurement 10min 3,100 6,600 4,400 9,400 o Free for long-term admission fee payers Measurement Microscope(AxioScopeA1) measurement 30min 5,100 11,000 7,300 15,700 o Free for long-term admission fee payers 4-Point Probe System(CMT-SR2000N) measurement 10min 3,100 6,600 4,400 9,400 o Free for long-term admission fee payers Probe station measurement 1hr 20,500 43,800 29,200 62,600 o Additional Fee
– Low temperature : 160,000 KRW/8hradmission fee fee by period Day 7,400KRW/DAY, 113,400KRW/1M, 225,800KRW/3M, 399,000KRW/6M -
공용장비이용료 Category Equipment(Model) Item Unit Charge Remark UNIST Self UNIST Request Self Request IVRC IVC System_Small animal Zone Mouse breeding cage/day 451 966 IVC System_Return animal Zone_Mouse IVC System_Return animal Zone_Rat Rat breeding 686 1,470 IVC System_MP Zone Mouse breeding 451 966 IVC System_Strain Presevation Zone 966 For request user only IVC System_Isolation Zone_Mouse Isolation-Mouse breeding 902 1,932 IVC System_Isolation Zone_Rat Isolation-Rat breeding 1,372 2,940 Anesthesia Prescription ea 5,500 7,800 Veterinarian-issued prescription Basic experiment others Disease Model Production Hr 21,900 47,000 31,300 67,100 Other surgeries and experimental support Embryo Freezing and Transplantation Experiment Embryo freezing variety 10,700 15,300 Embryo 200 ea Embryo frozen distribution ea 53,700 76,700 for 2 pairs Embryo transplantation variety 383,700 548,100 Including Microbial Monitoring, Excluding Transportation Fees Animal purification 844,100 1,205,800 Provision of Offspring at 4 Weeks after Surrogate Embryo Transfer (Includes Microbial Monitoring, Excludes Transportation Fees) Video Analysis Video Analysis Hr 6,500 14,000 9,400 20,000 Evaluation of motor sensory function Evaluation of motor sensory function Tissue-processor Tissue-processor ea 30,700 65,800 43,800 94,000 Paraffin embedding center Paraffin embedding center Hr 3,600 7,700 5,100 11,000 Microtome Microtome 4,600 9,900 6,600 14,100 Cryostat Cryostat H&E Staining H&E Staining ea 23,500 50,400 33,600 72,000 Special staining Special Staining 27,300 39,000 MRI 7T MRI Scanner for rodent models Hr 83,300 116,600 166,600 microCT Micro CT 30,700 65,800 43,800 94,000 In Vivo Optical Imaging System In vivo optical and X-ray imaging system 35,800 76,700 51,200 109,600 UOBC Confocal SIM Scan(FV1000) Imaging Analysis hr 25,600 54,800 36,500 78,300 Virtual Microscope(DOTSLIDE) 10,200 21,900 14,600 31,300 Confocal Microscope(FV10i) 15,300 32,900 21,900 47,000 Inverted Microscope(IX-71) 10,200 21,900 14,600 31,300 Microview(MVX10) Imaging Analysis(Fluorescence) Imaging Analysis 1 (ZEN, Imaris 8.0, MM, AQ) Software – 2,600 5,500 3,700 7,800 Imaging Analysis 2 (ZEN, Imaris 9.6) Lightsheet Analysis(Arivis, Imaris 9.6) Super Resolution Microscope(SIM) Imaging Analysis hr 51,200 109,600 73,100 156,600 Super Resolution Microscope(PALM) Calcium Imaging Microscope System 15,300 32,900 21,900 47,000 Multi-Photon Microscopy(LSM780NLO) 51,200 109,600 73,100 156,600 Laser Capture Microdissection 15,300 32,900 21,900 47,000 Light Sheet Microscope 51,200 109,600 73,100 156,600 High Sensitive and Multiplex 980(LSM980) Spectral and Live Cell Confocal(LSM780) Thunder 25,600 54,800 36,500 78,300 Material Confocal Microscope_OLS3100 10,200 21,900 14,600 31,300 IVRC IVC System_Small animal Zone Mouse breeding cage/day 451 966 IVC System_Return animal Zone_Mouse Mouse breeding cage/day 451 966 IVC System_Return animal Zone_Rat Rat breeding cage/day 686 1,470 IVC System_MP Zone Mouse breeding cage/day 451 966 IVC System_Strain Presevation Zone Mouse breeding cage/day 966 For request user only IVC System_Isolation Zone_Mouse Isolation-Mouse breeding cage/day 902 1,932 IVC System_Isolation Zone_Rat Isolation-Rat breeding cage/day 1,372 2,940 Anesthesia Prescription ea 5,500 7,800 Veterinarian-issued prescription Basic experiment others Disease Model Production Hr 21,900 47,000 31,300 67,100 Basic experiment others Other surgeries and experimental support Hr 21,900 47,000 31,300 67,100 Embryo Freezing and Transplantation Experiment Embryo freezing variety 10,700 15,300 Embryo 200 ea Embryo Freezing and Transplantation Experiment Embryo frozen distribution ea 53,700 76,700 for 2 pairs Embryo Freezing and Transplantation Experiment Embryo transplantation variety 383,700 548,100 Including Microbial Monitoring, Excluding Transportation Fees Embryo Freezing and Transplantation Experiment Animal purification variety 844,100 1,205,800 Provision of Offspring at 4 Weeks after Surrogate Embryo Transfer (Includes Microbial Monitoring, Excludes Transportation Fees) Video Analysis Video Analysis Hr 6,500 14,000 9,400 20,000 Evaluation of motor sensory function Evaluation of motor sensory function Hr 6,500 14,000 9,400 20,000 Tissue-processor Tissue-processor ea 30,700 65,800 43,800 94,000 Paraffin embedding center Paraffin embedding center Hr 3,600 7,700 5,100 11,000 Microtome Microtome Hr 4,600 9,900 6,600 14,100 Cryostat Cryostat Hr 4,600 9,900 6,600 14,100 H&E Staining H&E Staining ea 23,500 50,400 33,600 72,000 Special staining Special Staining ea 27,300 39,000 MRI 7T MRI Scanner for rodent models Hr 83,300 116,600 166,600 microCT Micro CT Hr 30,700 65,800 43,800 94,000 In Vivo Optical Imaging System In vivo optical and X-ray imaging system Hr 35,800 76,700 51,200 109,600 UOBC Confocal SIM Scan(FV1000) Imaging Analysis hr 25,600 54,800 36,500 78,300 Virtual Microscope(DOTSLIDE) Imaging Analysis hr 10,200 21,900 14,600 31,300 Confocal Microscope(FV10i) Imaging Analysis hr 15,300 32,900 21,900 47,000 Inverted Microscope(IX-71) Imaging Analysis hr 10,200 21,900 14,600 31,300 Microview(MVX10) Imaging Analysis(Fluorescence) hr 10,200 21,900 14,600 31,300 Imaging Analysis 1 (ZEN, Imaris 8.0, MM, AQ) Software – 2,600 5,500 3,700 7,800 Imaging Analysis 2 (ZEN, Imaris 9.6) Software – 2,600 5,500 3,700 7,800 Lightsheet Analysis(Arivis, Imaris 9.6) Software – 2,600 5,500 3,700 7,800 Super Resolution Microscope(SIM) Imaging Analysis hr 51,200 109,600 73,100 156,600 Super Resolution Microscope(PALM) Imaging Analysis hr 51,200 109,600 73,100 156,600 Calcium Imaging Microscope System Imaging Analysis hr 15,300 32,900 21,900 47,000 Multi-Photon Microscopy(LSM780NLO) Imaging Analysis hr 51,200 109,600 73,100 156,600 Laser Capture Microdissection Imaging Analysis hr 15,300 32,900 21,900 47,000 Light Sheet Microscope Imaging Analysis hr 51,200 109,600 73,100 156,600 High Sensitive and Multiplex 980(LSM980) Imaging Analysis hr 51,200 109,600 73,100 156,600 Spectral and Live Cell Confocal(LSM780) Imaging Analysis hr 51,200 109,600 73,100 156,600 Thunder Imaging Analysis hr 25,600 54,800 36,500 78,300 Material Confocal Microscope_OLS3100 Imaging Analysis hr 10,200 21,900 14,600 31,300