보유장비

HSC Sputter | 고단차피복 박막증착기

HSC Sputter
보유장비 관련 정보
연구실/분야
모델명 SRN-130
제조사 (주)소로나
담당자 김형일
연락처 052-217-4065 / [email protected]
예약 가능여부 가능
예약단위 1 1일최대예약시간 8
예약Open(~일 전) 2 예약취소불가(~일 전) 1
장비위치 NSB 108 Bldg. B101
  • Description

    HSC Sputtering system is a multi-purpose tool generating plasma inside chamber by supplying DC and RF power.
    This equipment is capable of high step coverage thin films and deposit various types of thin films by in-situ.

  • Specifications

    • Substrate size : 4, 6 inch wafer (10 slot/cassette)

    • Target size : 10 inch

    - Cathode#1(Al, Cr, Zn/ZnO) : Pulsed DC 15 kW

    - Cathode#2(Ti/TiN) : High step coverage DC 15 kW & 600 W RF power

    - Cathode#3(SiO2) : RF 2kW

    - Substrate pre clean : RF 600 W automatic processing

    • Substrate heating : 300 °C ± 3 %

    • Uniformity : less than ± 5 % within wafer

  • Applications

    • Thin film for semiconductor

    • Fabrication of contacts interconnects