DC Sputter | 메탈 스퍼터링 시스템
DC Sputtering system is a multi-purpose tool generating plasma inside chamber by supplying 3 kw DC power to cathode and capable of thin film deposition of metal materials on wafer by sputtering a metal target by DC negative voltage.
• Substrate size : 4, 6 inch wafer
• Substrate rotation speed : 0 ~ 60 rpm
• Substrate pre-cleaning : RF 300 W, automatic processing
• Substrate heating : 400 °C ± 3 % (wafer temp)
• Target materials : Ti, Cr, Al, Ag , Ta, Ni, Co, Mg, Mo, W..
• Power source : 3 kW DC power processing
• Uniformity : less than ± 5 % within wafer
• Thin film for semiconductor
• Fabrication of contacts interconnects