보유장비

DC Sputter | 메탈 스퍼터링 시스템

DC Sputter
보유장비 관련 정보
연구실/분야
모델명 SRN-120
제조사 SORONA
담당자 김형일
연락처 052-217-4065 / [email protected]
예약 가능여부 가능
예약단위 1hr 1일최대예약시간 2hr
예약Open(~일 전) 2주전 예약취소불가(~일 전) 2hr
장비위치 108동 B101호(Bldg, 108, Room B101)
  • Description

    DC Sputtering system is a multi-purpose tool generating plasma inside chamber by supplying 3 kw DC power to cathode and capable of thin film deposition of metal materials on wafer by sputtering a metal target by DC negative voltage.

  • Specifications

    • Substrate size : 4, 6 inch wafer

    • Substrate rotation speed : 0 ~ 60 rpm

    • Substrate pre-cleaning : RF 300 W, automatic processing

    • Substrate heating : 400 °C ± 3 % (wafer temp)

    • Target materials : Ti, Cr, Al, Ag , Ta, Ni, Co, Mg, Mo, W..

    • Power source : 3 kW DC power processing

    • Uniformity : less than ± 5 % within wafer

  • Applications

    • Thin film for semiconductor

    • Fabrication of contacts interconnects