Equipment

Dicing saw#2 | 기판절단장치

보유장비 관련 정보
Laboratory/Field
Model NDS-1012
Maker (주)네온테크
Technician Luda Lee
Contact 052-217-4022 / luda30159@unist.ac.kr
Status for Reservation 가능
Reservation Unit 2시간 Maximum Time (per day) 4시간
Open(~ago) 2주일 전 Cancel (~ago) 2시간
Equipment location 자연과학관(108동) B101호
  • Description

    Device to cut Silicon wafer into small chips using high-speed rotating diamond blade.

  • Specifications

    - Material Size: ø8”(Maximum ø200mm )

    - X-axis cutting range: 270 mm

    - Y-axis Indexing Range: 203 mm

    - Y-axis positioning error: 0.002mm/200mm

    - Spindle Speed Range: 3,000~50,000rpm

  • Applications

    • Wafer dicing for chip scale semiconductor

    • Si/glass wafer dicing for fabrication process