Equipment

Dicing Saw | 기판 절단장치

보유장비 관련 정보
Laboratory/Field
Model AR06DM
Maker Aaron
Technician Luda Lee
Contact 052-217-4022 / luda30159@unist.ac.kr
Status for Reservation 가능
Reservation Unit 2hr Maximum Time (per day) 2hr
Open(~ago) 2주전 Cancel (~ago) 2hr
  • Description

    Device to cut Silicon wafer into small chips using high-speed rotating diamond blade.

  • Specifications

    • Substrate size : 2 ~ 6 inch

    • Cutting materials : silicon, glass, quartz & GaAs

    • X-axis (chuck table horizontal movement)

    • Work-piece width setting range : 0.01 ~ 160 mm

    • Cutting range : 160 mm

    • Cut speed : 0.05 ~10 mm/s or more

  • Applications

    • Wafer dicing for chip scale semiconductor

    • Si/glass wafer dicing for fabrication process