Dicing Saw | 기판 절단장치
| Laboratory/Field | |||
|---|---|---|---|
| Model | AR06DM | ||
| Maker | Aaron | ||
| Technician | Eun Jeong Hwang | ||
| Contact | 052-217-4192 / [email protected] | ||
| Status for Reservation | 가능 | ||
| Reservation Unit | 2hr | Maximum Time (per day) | 2hr |
| Open(~ago) | 2주전 | Cancel (~ago) | 2hr |
| Equipment location | 108동 B101호 (Bldg. 108, Room B101) | ||
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Description
Device to cut Silicon wafer into small chips using high-speed rotating diamond blade.
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Specifications
• Substrate size : 2 ~ 6 inch
• Cutting materials : silicon, glass, quartz & GaAs
• X-axis (chuck table horizontal movement)
• Work-piece width setting range : 0.01 ~ 160 mm
• Cutting range : 160 mm
• Cut speed : 0.05 ~10 mm/s or more
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Applications
• Wafer dicing for chip scale semiconductor
• Si/glass wafer dicing for fabrication process