Substrate Bonder | 기판 접합 장치
| Laboratory/Field | |||
|---|---|---|---|
| Model | SB6L | ||
| Maker | Suss Microtec | ||
| Technician | Min-jae Kim | ||
| Contact | 052-217-4064 / [email protected] | ||
| Status for Reservation | 가능 | ||
| Reservation Unit | 5hr | Maximum Time (per day) | 5hr |
| Open(~ago) | 2주전 | Cancel (~ago) | 2hr |
| Equipment location | 108동 B101호 (Bldg.108, Room B101) | ||
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Description
Anodic bonder performs fine alignment and permanent bonding between 2 wafers by heat, voltage and pressure in a vacuum chamber.
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Specifications
• Wafer size : 6" semi standard wafer
• Pressure regulation accuracy : ± 2 %
• Maximum temperature : 500 °C
• Temperature uniformity : ± 3 %
• Maximum bond force : 8 kN
• Bond voltage and current (Anodic optional)
• Maximum voltage : 2,000 V ± polarity
• Maximum current : 60 mA
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Applications
• Anodic bonding for wafer to glass
• Thermo-compression bonding
• Eutectic bonding using metal layer